Carbon/aluminum composites with high thermal conductivity for thermal management applications

In this work, high performance graphite film/aluminum composites and diamond/aluminum composites were prepared for in-plane and isotropic high thermal conductivity requirements, respectively. The interfacial modification of graphite film/aluminum composite was carried out by matrix alloying. The ramifications of incorporating magnesium and silicon elements into the aluminum matrix were explored concerning the thermal conductivity and mechanical characteristics of the composite. The GF/Al0.8Mg0.5Si composite achieved a remarkable in-plane thermal conductivity of 707 W/(m center dot K). The interface modification of diamond/aluminum composite involved the surface coating of diamond particles with metal layers such as Ti and Cr, resulting in the composites achieving the highest thermal conductivities of 680 and 699 W/(m center dot K), respectively. Both the graphite film/aluminum composites and diamond/aluminum composites exhibited outstanding three-dimensional and in-plane thermal conductivities, respectively, showcasing significant potential for utilization in electronic packaging thermal management materials. This investigation serves as a valuable reference for interface modification techniques of carbon/aluminum composites