Materials for high-temperature digital electronics (vol 9, pg 790, 2024)

被引：0
|
作者：
Pradhan, Dhiren K. [1 ]
Moore, David C. [2 ]
Francis, A. Matt [3 ]
Kupernik, Jacob [3 ]
Kennedy, W. Joshua [2 ]
Glavin, Nicholas R. [2 ]
Olsson III, Roy H. [1 ]
Jariwala, Deep [1 ]
机构：
[1] Univ Penn, Dept Elect & Syst Engn, Philadelphia, PA 19104 USA
[2] Air Force Res Lab, Mat & Mfg Directorate, Dayton, OH USA
[3] Ozark Integrated Circuits, Fayetteville, AR USA
来源：
NATURE REVIEWS MATERIALS | 2025年 / 10卷 / 03期
关键词：
D O I：
10.1038/s41578-025-00789-z
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
引用
收藏
页码：243 / 243
页数：1
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