Evaluation of 2D Tantalum Carbide MXene for Room to Mid-temperature Thermoelectric Applications

被引:0
作者
Syamsai, Ravuri [3 ]
Vijay, Vaiyapuri [1 ,2 ]
Easwaran, Senthil Kumar [3 ]
Navaneethan, Mani [1 ,2 ,3 ]
机构
[1] SRM Inst Sci & Technol, Dept Phys & Nanotechnol, Funct Mat & Energy Devices Lab, Kattankulathur 603203, India
[2] SRM Inst Sci & Technol, Fac Engn & Technol, Ctr Excellence Mat & Adv Technol CeMAT, Kattankulathur 603203, India
[3] SRM Inst Sci & Technol, Fac Engn & Technol, Nanotechnol Res Ctr, Kattankulathur 603203, India
来源
CHEMNANOMAT | 2024年 / 10卷 / 12期
关键词
Seebeck coefficient; 2D materials; Lattice disorder; Dislocations; LATTICE-DYNAMICS; ELECTRODE; COMPOSITES; NANOSHEETS;
D O I
10.1002/cnma.202400391
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
Tantalum carbide MXene (Ta4C3Tx) were synthesized via HF etching of the Al intermediate layer from the parental tantalum aluminium carbide MAX phase (Ta4AlC3). The structural and vibrational studies confirm the formation of MXene from the MAX phase without disturbing the hexagonal crystal structure. The synthesized samples were analysed using XRD to understand the phase structure. In and out of plane vibrational properties were examined by Raman spectrometer. XPS confirms the successful HF etching of Al in MXene phase and all other elemental configurations. HR-SEM and HR-TEM revile the exfoliated layered structure of the MXene and hexagon diffraction pattern of the tantalum carbide MXene sample with increased d-spacing. The TGA analysis demonstrated the thermal stability of the as-synthesized post measured compounds. The synthesized tantalum carbide MXene shows stable thermoelectric properties over six thermal cycles. The temperature dependent transport properties were measured from 303 K to 803 K. Ta4C3Tx MXene shows a maximum Seebeck coefficient of 13.8 mu V/K and a power factor of 1.88 mu W/mK2 with the low lattice thermal conductivity of 5.42 W/mK at 803 K. In this present investigation, Tantalum carbide MXene demonstrated a decent thermoelectric property with high thermal cycling stability.
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页数:9
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