Si/Ge1-xSnx/Si transistors with highly transparent Al contacts

被引:0
作者
Wind, Lukas [1 ]
Preiss, Stefan [1 ]
Nazzari, Daniele [1 ]
Aberl, Johannes [2 ]
Navarrete, Enrique Prado [2 ]
Brehm, Moritz [2 ]
Vogl, Lilian [3 ]
Minor, Andrew M. [3 ]
Sistani, Masiar [1 ]
Weber, Walter M. [1 ]
机构
[1] Inst Solid State Elect TU Wien, A-1040 Vienna, Austria
[2] Johannes Kepler Univ Linz, Inst Semicond & Solid State Phys, A-4040 Linz, Austria
[3] Univ Calif Berkeley, Dept Mat Sci & Engn, Berkeley, CA 94720 USA
基金
奥地利科学基金会;
关键词
GeSn; Transistor; Transparent contacts; Transport investigations; Multi-gate architecture; MOSFETS;
D O I
10.1016/j.sse.2025.109069
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We study the monolithic quasi-ohmic contact formation with single-elementary Alto Ge1-xSnx channel devices with various Sn concentrations between 0.5 % and 4 %. Thereby we investigate the influence of increasing Sn content on the electrical transport properties in field-effect transistors fora wide temperature range between 77 K and 400 K. At low temperatures, the devices exhibit improved performance metrics, promising for cryoCMOS applications. Compared to pure Ge control devices, the introduction of Sn into the channel leads to a 20 times increased on-current. Ina multi-gate architecture, we analyze the decoupled influence of the carrier injection through the metal-semiconductor junction and the channel conduction.
引用
收藏
页数:4
相关论文
共 20 条
[1]   Epitaxial Growth of Planar Hutwires on Silicon-on-Insulator Substrates [J].
Aberl, Johannes ;
Vukusic, Lada ;
Fournel, Frank ;
Hartmann, Jean-Michel ;
Brehm, Moritz .
PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2022, 219 (17)
[2]   Quantitative determination of Ge profiles across SiGe wetting layers on Si (001) [J].
Brehm, M. ;
Grydlik, M. ;
Lichtenberger, H. ;
Fromherz, T. ;
Hrauda, N. ;
Jantsch, W. ;
Schaeffler, F. ;
Bauer, G. .
APPLIED PHYSICS LETTERS, 2008, 93 (12)
[3]   Electron Mobility Enhancement in GeSn n-Channel MOSFETs by Tensile Strain [J].
Chuang, Yen ;
Liu, Chia-You ;
Luo, Guang-Li ;
Li, Jiun-Yun .
IEEE ELECTRON DEVICE LETTERS, 2021, 42 (01) :10-13
[4]   A Run-Time Reconfigurable Ge Field-Effect Transistor With Symmetric On-States [J].
Fuchsberger, Andreas ;
Wind, Lukas ;
Nazzari, Daniele ;
Kuehberger, Larissa ;
Popp, Daniel ;
Aberl, Johannes ;
Navarrete, Enrique Prado ;
Brehm, Moritz ;
Vogl, Lilian ;
Schweizer, Peter ;
Lellig, Sebastian ;
Maeder, Xavier ;
Sistani, Masiar ;
Weber, Walter M. .
IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY, 2024, 12 :83-87
[5]   Clear Experimental Demonstration of Hole Gas Accumulation in Ge/Si Core-Shell Nanowires [J].
Fukata, Naoki ;
Yu, Mingke ;
Jevasuwan, Wipakorn ;
Takei, Toshiaki ;
Bando, Yoshio ;
Wu, Wenzhuo ;
Wang, Zhong Lin .
ACS NANO, 2015, 9 (12) :12182-12188
[6]   Achieving direct band gap in germanium through integration of Sn alloying and external strain [J].
Gupta, Suyog ;
Magyari-Koepe, Blanka ;
Nishi, Yoshio ;
Saraswat, Krishna C. .
JOURNAL OF APPLIED PHYSICS, 2013, 113 (07)
[7]   Vertically Stacked Strained 3-GeSn-Nanoshee pGAAFETs on Si Using GeSn/Ge CVD Epitaxial Growth and the Optimum Selective Channel Release Process [J].
Huang, Yu-Shiang ;
Lu, Fang-Liang ;
Tsou, Ya-Jui ;
Ye, Hung-Yu ;
Lin, Shih-Ya ;
Huang, Wen-Hung ;
Liu, C. W. .
IEEE ELECTRON DEVICE LETTERS, 2018, 39 (09) :1274-1277
[8]   High-Mobility CVD-Grown Ge/Strained Ge0.9Sn0.1/Ge Quantum-Well pMOSFETs on Si by Optimizing Ge Cap Thickness [J].
Huang, Yu-Shiang ;
Tsou, Ya-Jui ;
Huang, Chih-Hsiung ;
Huang, Chih-Hao ;
Lan, Huang-Siang ;
Liu, Chee Wee ;
Huang, Yi-Chiau ;
Chung, Hua ;
Chang, Chorng-Ping ;
Chu, Schubert S. ;
Kuppurao, Satheesh .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2017, 64 (06) :2498-2504
[9]  
Ibach H., 2009, Solid-state physics : an introduction to principles of materials science, V4th, P1
[10]   GeSn Vertical Gate-all-around Nanowire n-type MOSFETs [J].
Junk, Yannik ;
Frauenrath, Marvin ;
Han, Yi ;
Diaz, Omar Concepcion ;
Bae, Jin-Hee ;
Hartmann, Jean-Michel ;
Gruetzmacher, Detlev ;
Buca, Dan ;
Zhao, Qing-Tai .
ESSDERC 2022 - IEEE 52ND EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE (ESSDERC), 2022, :364-367