Experimental and numerical investigation on the performance of binary solid-solid phase change materials with integrated heat pipe and aluminium foam based heat sink for thermal management of electronic systems

Phase change material (PCM) is widely utilised in thermal management systems (TMS), however its low thermal conductivity inhibits performance. Heat pipe and porous materials are incorporated into PCM due to their high thermal conductivities to form a hybrid system that substantially enhances PCM's heat transfer capability. This study investigates experimentally and numerically, the cooling performance of heat sink by integrating aluminium foam and heat pipe (HP) with binary Neopentyl glycol (NPG)/Trihydroxy methyl-aminomethane (TAM) solid-solid phase change material (SS_PCM) obtained at 90/10 wt% (N9T1), 70/30 wt% (N7T3) and 50/50 wt% (N5T5). Compared to pure NPG thermal conductivity, N9T1, N7T3, and N5T5 samples demonstrated relative enhancement ratios of 0.017, 2.46, and 2.84. Different heat sink configurations are examined at three constant power levels 15, 17 and 19 W for the same charging period of 10000 s to determine the optimal cooling arrangement. During the charging period, hybrid cooling (PCM-Foam-HP) system with fan in contrast to an empty sink achieved the highest temperature reduction of 58.31 %, 58.99 % and 59.89 % at power levels of 15, 17 and 19 W, respectively. N9T1, N7T3 and N5T5 combinations lowered temperature by 4.6 %, 5.9 % and 10.8 %, respectively, when compared to NPG. Furthermore, all configurations performed better at lower heat generation rates by extending the safe operational period (SOP).The investigation concluded that N5T5 SS_PCMaided heat sinks with integrated aluminium foam and heat pipe with fan reduced temperatures the most and performed best in all aspects. Finally, the experimental results for TMS were numerically validated using COMSOL software.