253 GHz fT Graded-Channel AlGaN/GaN High-Electron-Mobility Transistors with New Cliff Barrier for Millimeter Wave High-Frequency Applications

被引:0
作者
Franklin, S. Angen [1 ]
Jebalin, I. V. Binola K. [2 ]
Chander, Subhash [3 ]
Rani, Sylvia Juliet [1 ]
Nirmal, D. [1 ]
机构
[1] Karunya Inst Technol & Sci, Dept Elect & Commun Engn, Coimbatore 641114, India
[2] Karunya Inst Technol & Sci, Dept Biomed Engn, Coimbatore 641114, India
[3] Solid State Phys Lab DRDO, Lucknow Rd, Timarpur 110054, Delhi, India
来源
PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE | 2024年
关键词
cliff barrier; high-electron-mobility transistor; power-added efficiency; process steps; radio frequency; LAYER THICKNESS; GAN; GATE; PERFORMANCE; IMPACT; HEMTS; RF;
D O I
10.1002/pssa.202400552
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this research work, a graded-channel AlGaN/GaN high-electron-mobility transistor (HEMT) featuring a cliff AlGaN barrier with a gate length of 60 nm is investigated. The inclusion of a foot cliff barrier layer confines the 3DEG distribution, thereby reducing electron scattering and potentially improving carrier mobility. The cliff-graded-channel device shows a peak cutoff frequency fT of 253 GHz and power-added efficiency of 68% at 30 GHz, which represents a significant 60% improvement in comparison with conventional graded-channel devices. These results clearly indicate that the graded-channel AlGaN/GaN HEMT with a new cliff barrier design has great potential for mmW applications.
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页数:6
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共 32 条
  • [1] Reliability Assessment of AlGaN/GaN Schottky Barrier Diodes Under ON-State Stress
    Acurio, Eliana
    Trojman, Lionel
    Crupi, Felice
    Moposita, Tatiana
    De Jaeger, Brice
    Decoutere, Stefaan
    [J]. IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2020, 20 (01) : 167 - 171
  • [2] Model to explain the behavior of 2DEG mobility with respect to charge density in N-polar and Ga-polar AlGaN-GaN heterostructures
    Ahmadi, Elaheh
    Keller, Stacia
    Mishra, Umesh K.
    [J]. JOURNAL OF APPLIED PHYSICS, 2016, 120 (11)
  • [3] Estimation of electrostatic, analogue, Linearity/RF figures-of-merit for GaN/SiC HEMT
    Alam, Sabrina
    Jui, Fahmida Sharmin
    Gaquiere, Christophe
    Alim, Mohammad Abdul
    [J]. MICRO AND NANOSTRUCTURES, 2024, 186
  • [4] Impact of barrier layer thickness on DC and RF performance of AlGaN/GaN high electron mobility transistors
    Anand, Anupama
    Sehra, Khushwant
    Narang, Rakhi
    Rawal, D. S.
    Mishra, M.
    Saxena, Manoj
    Gupta, Mridula
    [J]. APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2023, 129 (08):
  • [5] Compositionally Graded III-N HEMTs for Improved Linearity: A Simulation Study
    Ancona, M. G.
    Calame, J. P.
    Meyer, D. J.
    Rajan, S.
    Downey, B. P.
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2019, 66 (05) : 2151 - 2157
  • [6] Reactive ion etching of GaN and AlxGa1-xN using Cl2/CH4/Ar plasma
    Basak, D
    Yamashita, K
    Sugahara, T
    Fareed, Q
    Nakagawa, D
    Nishino, K
    Sakai, S
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1999, 38 (4B): : 2646 - 2651
  • [7] Theoretical Prediction of Mobility Improvement in GaN-Based HEMTs at High Carrier Densities
    Berdalovic, Ivan
    Poljak, Mirko
    Suligoj, Tomislav
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2023, 70 (03) : 1425 - 1429
  • [8] Impact of barrier thickness on Analog, RF and Linearity performance of nanoscale DG heterostructure MOSFET
    Biswas, Kalyan
    Sarkar, Angsuman
    Sarkar, Chandan Kumar
    [J]. SUPERLATTICES AND MICROSTRUCTURES, 2015, 86 : 95 - 104
  • [9] A Sub-Critical Barrier Thickness Normally-Off AlGaN/GaN MOS-HEMT
    Brown, Raphael
    Macfarlane, Douglas
    Al-Khalidi, Abdullah
    Li, Xu
    Ternent, Gary
    Zhou, Haiping
    Thayne, Iain
    Wasige, Edward
    [J]. IEEE ELECTRON DEVICE LETTERS, 2014, 35 (09) : 906 - 908
  • [10] Investigation on Fe-Doped AlGaN/GaN HEMT at 148 GHz Using E-FPL Technology for High-Frequency Communication Systems
    Franklin, S. Angen
    Jebalin, I. V. Binola K.
    Chander, Subhash
    Kumar, Raj
    Ajayan, J.
    Nirmal, D.
    [J]. ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2023, 12 (03)