Dielectric Heating Protocol of Three Low Moisture Flours as Affected by Moisture, Temperature and Mass at 2.45 and 5.8 GHz

Present studies investigate the dielectric properties (dielectric constant and dielectric loss factor) of three low moisture flours (barley, chickpea and wheat) in the moisture content range 2%-10% (w. b.) and temperatures 10 degrees C-60 degrees C at 2.45 and 5.8 GHz. Measurements were taken using cavity perturbation method in conjunctions with Vector Network Analyzer. Results show that dielectric constant and loss factor increased with temperature as well as moisture content both at 2.45 and 5.8 GHz but decreased with increase in frequency. Change in mass of all flours during heating does not affect dielectric properties at both frequencies. A second order regression equation is generated to predict dielectric properties at both frequencies for entire temperature and moisture. Penetration depths of all flours decreased with increase in moisture content and temperature at 2.45 and 5.8 GHz. These studies provide valuable insights to heating protocol of flours in view of recent flours-related disease outbreaks.