Enhancement of heat transfer performance by varying pin shape and incorporating perforations and bulges in plate pin fin heat sink

High heat fluxes in electronic chips require effective thermal management during system development, balancing high performance with reduced power consumption. This research aims to achieve this balance by investigating the Plate Pin Fin Heat Sink (PPFHS) and improving the thermal performance factor (TPF) through modifications to pin designs. Three different designs were examined: 1. PPFHS with wavy bulged pins integrated with perforations, 2. PPFHS with rook-shaped pins and ovoid perforations, 3. PPFHS with candy-shaped pins. The numerical modeling was performed using ANSYS 2021 R2, with boundary conditions and the selection of the RANS model based on validation processes. All three designs maintained the same surface area. Pressure drops and base temperatures were recorded for these designs, and the TPF values were calculated to determine the best design. The PPFHS-Rook design demonstrated the highest increase in TPF, with an improvement of 3.2 % compared to the original PPFHS. Additionally, it exhibited the lowest pressure drop, decreased by 12.849 % relative to the PPFHS. The other designs also showed significant reductions in pressure drop while decreasing the volume of the traditional pin fins.