Design of temperature control system for burn-in test based on fuzzy adaptive PID control algorithm

被引：0
作者：
Duan, Yuhe [1 ]
Ji, Haoyue [1 ]
Sun, Xiaodong [1 ]
Tian, Wenchao [2 ]
Cui, Hao [2 ]
机构：
[1] CKS Integrated Circuit Co Ltd, Microsystems Ctr, Wuxi, Jiangsu, Peoples R China
[2] Xidian Univ, Xian, Peoples R China
来源：
2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT | 2022年
关键词：
SIP; aging; temperature contro; fuzzy adaptive PID;
D O I：
10.1109/ICEPT56209.2022.9873275
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In order to make the accuracy of temperature control of SIP chips in the aging test not affected by external interference and mathematical models, a paste-adaptive PID temperature control system suitable for the aging test of SIP chips was designed. By analyzing the influence of the changes of the two input variables of temperature deviation and deviation change rate on the aging test temperature, a fuzzy control rule table is established. The influence of control performance is completed, and the simulation and field debugging of the entire fuzzy adaptive PID temperature control scheme are completed. The test results show that the temperature control effect of the burn-in test based on the fuzzy adaptive PID control algorithm is 31.25% higher than that of the conventional PID control algorithm, and the anti-interference performance is improved by 66.6%.
引用
收藏
页数：6
相关论文
共 16 条
  • [1] Development and Performance Study of Temperature and Humidity Regulator in Baby Incubator Using Fuzzy-PID Hybrid Controller
    Alimuddin, Alimuddin
    Arafiyah, Ria
    Saraswati, Irma
    Alfanz, Rocky
    Hasudungan, Partogi
    Taufik, Taufik
    [J]. ENERGIES, 2021, 14 (20)
  • [2] [白冰 Bai Bing], 2016, [清华大学学报. 自然科学版, Journal of Tsinghua University. Science and Technology], V56, P294
  • [3] Fang Liu, 2019, Quality and Certification, P81
  • [4] [贺自名 He Ziming], 2021, [控制工程, Control Engineering of China], V28, P1308
  • [5] Kamal Rsetam, 2022, Case Studies in Thermal Engineering, P30
  • [6] Lee Yanming, 2018, Journal of Engineering Science and Technology Review, V11
  • [7] Li Xiaoliang, 2020, J. Electronics and Packaging, V20, P63, DOI [10.1007/JHEP09(2020)063[arXiv:2003.12987[hep-th]], DOI 10.1007/JHEP09(2020)063[ARXIV:2003.12987[HEP-TH]]]
  • [8] Liu Jie, 2015, Electronic Measurement Technology, V38, P127
  • [9] Liu Xiaowen, 2017, Environmental Technology, V35, P15
  • [10] Luo Junjie, 2021, Electronic World, P137
12