Advanced Packaging, Heterogeneous Integration, and Foundry 2.0

被引：0
作者：
Patti, Robert [1 ]
机构：
[1] NHanced Semicond Inc, Batavia, IL 60510 USA
来源：
2024 IEEE 67TH INTERNATIONAL MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS, MWSCAS 2024 | 2024年
关键词：
Advanced Packaging; Heterogeneous Integration; Chiplet; Interposer; 3DIC; Foundry; 2.0;
D O I：
10.1109/MWSCAS60917.2024.10658948
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
The invention of the system-on-chip (SoC) was a huge leap forward from the standard semiconductor circuit board. Today the industry sees another leap forward: advanced packaging (AP). This paradigm shift in yield and performance enables affordable customization, true heterogeneous integration (HI), and a new manufacturing model: Foundry 2.0.
引用
收藏
页码：873 / 874
页数：2
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