20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering

被引：2

作者：

Ji, Xinrui ^{[1
]}

Du, Leiming ^{[1
]}

van Zeijl, Henk ^{[1
]}

Zhang, Guoqi ^{[1
]}

Derakhshandeh, Jaber ^{[2
]}

Beyne, Eric ^{[2
]}

机构：

[1] Delft Univ Technol, Microelect, ECTM, Delft, Netherlands

[2] IMEC, Leuven, Belgium

来源：

PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024 | 2024年

关键词：

copper nanoparticles; flip chip; fine pitch; all-Cu interconnects;

D O I：

10.1109/ECTC51529.2024.00221

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This report demonstrates an innovative method to achieve large scale 20 mu m pitch Cu-Cu direct bonding, utilizing lithographic stencil printing to transfer small-sized nano-copper (CuNPs) paste and employs a thermocompression method for CuNPs sintering to establish interconnections between copper-pillars and CuNPs bumps. Shear tests were conducted to characterize the bonding strength. High-throughput 20 mu m pitch copper-to-copper direct bonding enables lower annealing temperatures for bulk- Cu to bulk-Cu bonding. Lithographic stencil printing is used to transfer the CuNPs paste, followed by sintering of the nanoparticles to establish interconnections. Shear tests and cross-section SEM were conducted to characterize the bonding strength and quality.

引用

页码：1891 / 1895

页数：5

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