Synergistic Enhancement of Mechanical Properties and Electrical Conductivity of Immiscible Bimetal: A Case Study on W-Cu

被引:0
|
作者
Duan, Qixiang [1 ]
Hou, Chao [1 ]
Han, Tielong [1 ]
Li, Yurong [1 ]
Wang, Haibin [1 ]
Song, Xiaoyan [1 ]
Nie, Zuoren [1 ]
机构
[1] Beijing Univ Technol, Coll Mat Sci & Engn, Key Lab Adv Funct Mat, Minist Educ, Beijing 100124, Peoples R China
来源
ENGINEERING | 2025年 / 46卷
基金
中国国家自然科学基金;
关键词
Immiscible bimetal; Phase configuration; Mechanical property; Electrical conductivity; Strain response; GRAINED TUNGSTEN; COMPOSITES; MICROSTRUCTURE; TEMPERATURE; FABRICATION; STRENGTH; BEHAVIOR; DENSIFICATION; POWDER; ALLOY;
D O I
10.1016/j.eng.2024.07.024
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Immiscible bimetal systems, of which tungsten-copper (W-Cu) is a typical representative, have crucial applications in fields requiring both mechanical and physical properties. Nevertheless, it is a major challenge to determine how to give full play to the advantages of the two phases of the bimetal and achieve outstanding comprehensive properties. In this study, an ultrafine-grained W-Cu bimetal with spatially connected Cu and specific W islands was fabricated through a designed powder-mixing process and subsequent rapid low-temperature sintering. The prepared bimetal concurrently has a high yield strength, large plastic strain, and high electrical conductivity. The stress distribution and strain response of individual phases in different types of W-Cu bimetals under loading were quantified by means of a simulation. The high yield strength of the reported bimetal results from the microstructure refinement and high contiguity of the grains in the W islands, which enhance the contribution of W to the total plastic deformation of the bimetal. The high electrical conductivity is attributed to the increased mean free path of the Cu and the reduced proportion of phase boundaries due to the specific phase combination of W islands and Cu. This work provides new insight into modulating phase configuration in immiscible metallic composites to achieve high-level multi-objective properties. (c) 2024 THE AUTHORS. Published by Elsevier LTD on behalf of Chinese Academy of Engineering and Higher Education Press Limited Company. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
引用
收藏
页码:224 / 235
页数:12
相关论文
共 50 条
  • [41] Microstructure, mechanical properties, electrical conductivity and wear behavior of high volume TiC reinforced Cu-matrix composites
    Akhtar, Farid
    Askari, Syed Javid
    Shah, Khadijah Ali
    Du, Xueli
    Guo, Shiju
    MATERIALS CHARACTERIZATION, 2009, 60 (04) : 327 - 336
  • [42] Microstructure, mechanical properties and electrical conductivity of Cu-12 wt.% Fe microcomposite annealed at different temperatures
    Wu, Z. W.
    Liu, J. J.
    Chen, Y.
    Meng, L.
    JOURNAL OF ALLOYS AND COMPOUNDS, 2009, 467 (1-2) : 213 - 218
  • [43] Enhancement of Electrical Conductivity and Assessment of Thermal and Mechanical Properties of Graphene/Epoxy Nanocomposites
    Al Imran, K.
    Shivakumar, K. N.
    PROCEEDINGS OF THE AMERICAN SOCIETY FOR COMPOSITES: THIRTIETH TECHNICAL CONFERENCE, 2015, : 235 - 251
  • [44] Study on Mechanical and Electrical Properties of High Content CNTs/Cu Composites
    Xiu, Ziyang
    Sun, Jinpeng
    Li, Xiao
    Chen, Yihao
    Yan, Yue
    Shao, Puzhen
    Li, Haozhe
    Ju, Boyu
    Yang, Wenshu
    Chen, Guoqin
    MATERIALS, 2024, 17 (15)
  • [45] Electrical Conductivity of Cu and Cu-2vol.% Nb Powders and the Effect of Varying Sintering Temperatures on their Mechanical Properties Using Spark Plasma Sintering
    Eze, A. A.
    Jamiru, T.
    Sadiku, E. R.
    Diouf, S.
    Durowoju, M. O.
    Ibrahim, I. D.
    Kupolati, W. K.
    SILICON, 2017, 9 (06) : 855 - 865
  • [46] Microstructures and properties of W-Cu functionally graded composite coatings on copper substrate via high-energy mechanical alloying method
    Meng, Yunfei
    Zhang, Jiaping
    Duan, Cuiyuan
    Chen, Cheng
    Feng, Xiaomei
    Shen, Yifu
    ADVANCED POWDER TECHNOLOGY, 2015, 26 (02) : 392 - 400
  • [47] Enhanced mechanical properties and electrical conductivity of graphene nanoplatelets/Cu composites by in situ formation of Mo2C nanoparticles
    Guo, Siyuan
    Zhang, Xiang
    Shi, Chunsheng
    Liu, Enzuo
    He, Chunnian
    He, Fang
    Zhao, Naiqin
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 766
  • [48] Mechanical Properties, Fatigue Life, and Electrical Conductivity of Cu-Cr-Hf Alloy after Equal Channel Angular Pressing
    Shangina, Daria V.
    Terent'ev, Vladimir F.
    Prosvirnin, Dmitry V.
    Antonova, Olga V.
    Bochvar, Natalia R.
    Gorshenkov, Mikhail V.
    Raab, Georgy I.
    Dobatkin, Sergey V.
    ADVANCED ENGINEERING MATERIALS, 2018, 20 (01)
  • [49] Enhanced mechanical properties and thermal conductivity of W-30Cu composite fabricated with monodisperse and nearly spherical W powder
    Chen, Zheng
    Li, Bingxue
    Zhang, Qiao
    Ding, Yi
    Zhu, Zhixiang
    Xiao, Peng
    Liang, Shuhua
    INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS, 2021, 101
  • [50] Microstructure and mechanical properties investigation of W-Cu composites prepared from dual-layer coated powders
    Li, Yuan
    Luo, Guoqiang
    Sun, Yi
    Zhang, Jian
    Shen, Qiang
    Zhang, Lianmeng
    APPLIED SURFACE SCIENCE, 2020, 516