Scanning Microwave Impedance Microscopy for Characterization of Graphene Systems Encapsulated by Hexagonal Boron Nitride

被引:1
作者
Bargas, Gabriel [1 ]
Ohlberg, Douglas A. A. [2 ]
Watanabe, Kenji [3 ]
Taniguchi, Takashi [4 ]
Campos, Leonardo C. [1 ]
Medeiros-Ribeiro, Gilberto [2 ,5 ]
机构
[1] Univ Fed Minas Gerais, Dept Fis, Ave Pres Antonio Carlos 6627, BR-31270901 Belo Horizonte, MG, Brazil
[2] Univ Fed Minas Gerais, Ctr Microscopia, Ave Pres Antonio Carlos 6627, BR-31270901 Belo Horizonte, MG, Brazil
[3] Natl Inst Mat Sci, Res Ctr Elect & Opt Mat, 1-1 Namiki, Tsukuba, Ibaraki 3050044, Japan
[4] Natl Inst Mat Sci, Res Ctr Mat Nanoarchitecton, 1-1 Namiki, Tsukuba, Ibaraki 3050044, Japan
[5] Univ Fed Minas Gerais, Dept Ciencias Comp, Ave Pres Antonio Carlos 6627, BR-31270901 Belo Horizonte, MG, Brazil
来源
PHYSICA STATUS SOLIDI B-BASIC SOLID STATE PHYSICS | 2024年
关键词
characterization; encapsulation; hexagonal boron nitride; scanning microwave impedance microscopy; twisted bilayer graphene; BILAYER GRAPHENE; TWIST-ANGLE; SUPERCONDUCTIVITY; DYNAMICS; DEFECTS;
D O I
10.1002/pssb.202400548
中图分类号
O469 [凝聚态物理学];
学科分类号
070205 ;
摘要
Scanning microwave impedance microscopy (sMIM) is a near-field technique that enables the characterization of conductive materials with a resolution down to 1 nm. In hexagonal boron nitride (hBN)-encapsulated devices, microwaves emitted from the sMIM tip penetrate and reach with the underlying 2D materials, allowing for the mapping of local conductivity variations. Using twisted bilayer graphene, it is demonstrated that this technique can characterize moir & eacute; patterns through hBN flakes up to 2.5 nm thick. Additionally, it is showed that sMIM can distinguish between conductive and insulating materials in samples encapsulated by hBN layers exceeding 15 nm. A key finding is that signal decay due to encapsulation is intrinsically linked to the tip's condition. This work overcomes limitations in the application of twistronics, enabling the verification of the periodicity of moir & eacute; patterns in high-quality encapsulated devices between electrical contacts.
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页数:7
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