Simulation and Experimental Analysis of Surface Defect Formation of SiCp/Al Composites during Ultrasonic Vibration-Assisted Cutting

被引:1
作者
Wu, Qingling [1 ]
Du, Yongsheng [2 ]
Yang, Yakun [2 ]
Zhai, Shuaijie [2 ]
Wang, Chao [2 ]
机构
[1] JiLin Commun Polytech, Changchun 130000, Peoples R China
[2] Changchun Univ Technol, Sch Mechatron Engn, Key Lab Micro Nano & Ultraprecis Mfg Jilin Prov, Changchun 130012, Peoples R China
关键词
SiCp/Al composite; surface defect formation; ultrasonic vibration-assisted cutting; SILICON-CARBIDE; REMOVAL MECHANISM; AMPLITUDE;
D O I
10.1007/s11665-024-10605-4
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
SiCp/Al has a wide range of applications due to its excellent performance, but traditional cutting process has bottlenecks such as low cutting efficiency, poor surface quality and surface defects. Ultrasonic vibration-assisted cutting is a proven method for reducing surface defects compared to traditional cutting. In this paper, a two-dimensional finite element model of SiCp/Al composites cutting by UVAC in view of particle-interface-substrate was established. Different material properties were given to SiCp/Al composites, respectively, and the interface constitutive model adopts the cohesive force model. Through simulation, the surface defects of SiCp/Al composites cut by UVAC is studied in depth, and the experimental verification is carried out by surface morphology experiments. The simulation results show that the surface defects in the UVAC process mainly include particle rolling into the matrix, particle fracture and particle debonding and pulling out. After experimental verification, it is consistent with the simulation results. The surface roughness Sa is reduced from 1.44 to 0.446 um, which improves the processing surface quality.
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页数:10
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