Vat photopolymerization of high-strength aluminum nitride ceramics through nitrate additives coating

被引:1
作者
Qi, Yujie [1 ]
Wu, Haidong [1 ]
Zhang, Wenduo [1 ]
Huang, Pengjin [1 ]
Chen, Xuanzhi [1 ]
Lin, Kunji [1 ]
Wu, Shanghua [1 ]
机构
[1] Guangdong Univ Technol, Sch Electromech Engn, Guangzhou 510006, Peoples R China
关键词
Aluminum nitride; Vat photopolymerization; Nitrate additives; Mechanical performance; Thermal conductivity; HIGH-THERMAL-CONDUCTIVITY; MECHANICAL-PROPERTIES; ALN CERAMICS; FRACTURE-BEHAVIOR; GRAIN-SIZE; FABRICATION; POWDER; MICROSTRUCTURE; DENSIFICATION; DECOMPOSITION;
D O I
10.1016/j.jeurceramsoc.2025.117228
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Aluminum nitride ceramics are widely used in electronic devices, but their applications are hindered by relatively low mechanical strength. A multicomponent sintering additive approach was employed to address it. Yttrium hexahydrate nitrate, samarium hexahydrate nitrate, and scandium monohydrate nitrate were incorporated to develop AlN ceramics with mechanical properties via vat photopolymerization comparable to those of Si3N4 ceramics. The influence of different nitrate contents on the viscosity and curing behavior of AlN suspensions was investigated. The results show that curing performance of AlN suspensions used for printing was optimized. Furthermore, dense AlN ceramics were fabricated through pressureless sintering at 1800 degrees C for 4 hours. The samples incorporating ternary sintering additives exhibited the highest comprehensive performance with a flexural strength and thermal conductivity of 616.6 MPa and 74.09 W/(m center dot k). This represents a significant advancement in the development of digital light processing-printed AlN ceramics with mechanical performance levels approaching those of Si3N4 ceramics.
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页数:14
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