共 50 条
- [2] Experimental Modal Analysis and Random Vibration Simulation of Printed Circuit Board Assembly ADVANCES IN VIBRATION ENGINEERING, 2013, 12 (05): : 489 - 498
- [5] Improving intrinsic corrosion reliability of printed circuit board assembly PROCEEDINGS OF THE 2016 IEEE 18TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2016, : 540 - 544
- [6] Printed Circuit Board Assembly Modeling for Predictive Reliability Assessment 2022 IEEE 28TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME), 2022, : 52 - 57
- [8] High Reliability Pb-Free Printed Circuit Board Assembly ADVANCED DESIGN AND MANUFACTURE III, 2011, 450 : 9 - +
- [9] PBGA solder joint fatigue under temperature cycling, random vibration and combined vibration and thermal cycling loading conditions Hanjie Xuebao/Transactions of the China Welding Institution, 2021, 42 (09): : 49 - 54