High-performance Cu-Cu interconnects attained through air sintering of oleylamine-capped Cu nanoparticles for power electronics packaging

被引:0
作者
Xia, Shi-Yu [1 ]
Li, Xiang-Ji [2 ]
Guo, Ying-Jie [1 ]
Yuan, Jun-Jie [1 ]
Sun, Zhe-Fei [1 ]
Cao, Hui-Jun [3 ]
Zhang, Shu-Ye [4 ]
Cai, Wen-Zhi [3 ]
Li, Jin-Tang [1 ]
Zhang, Zhi-Hao [1 ]
机构
[1] Xiamen Univ, Coll Mat, Dept Mat Sci & Engn, Fujian Key Lab Adv Mat, Xiamen 361005, Peoples R China
[2] Sungkyunkwan Univ, Sch Adv Mat Sci & Engn, Suwon 16419, South Korea
[3] Xiamen City Univ, Sch Transportat Engn, Xiamen 361005, Peoples R China
[4] Harbin Inst Technol, State Key Lab Adv Welding & Jointing, Harbin 150001, Peoples R China
来源
RARE METALS | 2025年
关键词
Air sintering; Power electronics packaging; Cu nanoparticles; Flexible sensor; LOW-TEMPERATURE; PARTICLE PASTE; OXIDATION RESISTANCE; COPPER NANOPARTICLES; BONDING STRENGTH; INK; DECOMPOSITION; CONDUCTIVITY; REDUCTION; SUBSTRATE;
D O I
10.1007/s12598-024-03076-y
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Cu nanoparticles exhibit excellent properties as high-temperature-resistant, conductive, heat-dissipating, and connecting materials. However, their susceptibility to oxidation poses a major challenge to the production of high-quality sintered bodies in the air, severely limiting their widespread adoption in power electronics packaging. This study presents a novel approach to the synthesis of Cu nanoparticles capped with oleylamine ligands. By employing a simple solvent-cleaning process, effective control of the density of oleylamine ligands on particle surfaces was achieved, resulting in high-performance Cu nanoparticles with both oxidation resistance and air-sintering susceptibility. Moreover, through our research, the solvent-cleaning mechanism was clarified, a model for the oleylamine ligand decomposition was developed, the air-sintering behavior of Cu nanoparticles was analyzed, and the impacts of both the sintered bodies and interfaces on the sintering performance were explained. Additionally, Cu nanoparticles subjected to 5 cleaning rounds followed by sintering at 280 degrees C and 5 MPa in air were confirmed to be able to produce the highest shear strength (49.2 +/- 3.51 MPa) and lowest resistivity (6.15 +/- 0.32 mu Omega<middle dot>cm). Based on these results, flexible capacitive pressure sensors with Cu sintered electrodes were fabricated and demonstrated a stable pressure-capacitance response over the temperature range of 25-250 degrees C. These findings underscore the impressive robustness and durability of sintered structures and the potential for high-temperature applications of oleylamine-capped Cu nanoparticles. Our study provides reliable application demonstrations for the low-cost manufacture of high-performance power electronics packaging structures that can operate in high-current-density, high-heat-flow-density, high-temperature, and high-stress environments. (sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic),(sic)(sic),(sic)(sic),(sic)(sic)(sic)(sic), (sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic), (sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic).(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic), (sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic), (sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic).(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic), (sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic), (sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic), (sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic),(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic).(sic)(sic)(sic)(sic), (sic)5(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)280 degrees C,5 MPa,(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(49.2 +/- 3.51 MPa),(sic)(sic)(6.15 +/- 0.32 mu Omega<middle dot>cm)(sic)(sic).(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic), (sic)(sic)(sic)(sic)(sic)25-250 degrees C(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)-(sic)(sic)(sic)(sic), (sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic),(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic).(sic)(sic)(sic)(sic)(sic)(sic),(sic)(sic)(sic),(sic)(sic)(sic)(sic)(sic),(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)(sic)..
引用
收藏
页码:3281 / 3298
页数:18
相关论文
共 56 条
[1]   Die-attach bonding for high temperature applications using thermal decomposition of copper(II) formate with polyethylene glycol [J].
Bhogaraju, Sri Krishna ;
Mokhtari, Omid ;
Conti, Fosca ;
Elger, Gordon .
SCRIPTA MATERIALIA, 2020, 182 (182) :74-80
[2]   Controlled synthesis of copper nano/microstructures using ascorbic acid in aqueous CTAB solution [J].
Bicer, Mustafa ;
Sisman, Ilkay .
POWDER TECHNOLOGY, 2010, 198 (02) :279-284
[3]   Ligand Decomposition Differences during Thermal Sintering of Oleylamine-Capped Gold Nanoparticles in Ambient and Inert Environments: Implications for Conductive Inks [J].
Chang, Kai ;
Podder, Chinmoy ;
Pan, Heng .
ACS APPLIED NANO MATERIALS, 2023, 6 (24) :23418-23429
[4]   Interfacial oxidation protection and thermal-stable sinter Ag joining on bare Cu substrate by single-layer graphene coating [J].
Chen, Chuantong ;
Zhang, Zheng ;
Kim, Dongjin ;
Zhang, Bowen ;
Tanioku, Masami ;
Ono, Takao ;
Matsumoto, Kazuhiko ;
Suganuma, Katsuaki .
APPLIED SURFACE SCIENCE, 2019, 497
[5]   Cu@Sn Core-Shell Structure Powder Preform for High-Temperature Applications Based on Transient Liquid Phase Bonding [J].
Chen, Hongtao ;
Hu, Tianqi ;
Li, Mingyu ;
Zhao, Zhenqing .
IEEE TRANSACTIONS ON POWER ELECTRONICS, 2017, 32 (01) :441-451
[6]   GECAM Detection of a Bright Type I X-Ray Burst from 4U 0614+09: Hint for Its Spin Frequency at 413 Hz [J].
Chen, Yu-Peng ;
Li, Jian ;
Xiong, Shao-Lin ;
Ji, Long ;
Zhang, Shu ;
Peng, Wen-Xi ;
Qiao, Rui ;
Li, Xin-Qiao ;
Wen, Xiang-Yang ;
Song, Li-Ming ;
Zheng, Shi-Jie ;
Song, Xin-Ying ;
Zhao, Xiao-Yun ;
Huang, Yue ;
Lu, Fang-Jun ;
Zhang, Shuang-Nan ;
Xiao, Shuo ;
Cai, Ce ;
An, Zheng-Hua ;
Chang, Zhi ;
Chen, Can ;
Chen, Gang ;
Chen, Wei ;
Dai, Guang-Qi ;
Du, Yan-Qi ;
Gao, Min ;
Gong, Ke ;
Guo, Dong-Ya ;
Guo, Zhi-Wei ;
He, Jian-Jian ;
Li, Bin ;
Li, Chao ;
Li, Chao-Yang ;
Li, Gang ;
Li, Jian-Hui ;
Li, Lu ;
Li, Qing-Xin ;
Li, Xiao-Bo ;
Li, Yan-Guo ;
Liang, Jing ;
Liang, Xiao-Hua ;
Liao, Jin-Yuan ;
Liu, Jia-Cong ;
Liu, Xiao-Jing ;
Liu, Ya-Qing ;
Luo, Qi ;
Ma, Xiang ;
Meng, Bin ;
Ou, Ge ;
Shi, Dong-Li .
ASTROPHYSICAL JOURNAL, 2022, 935 (01)
[7]   Retarding oxidation of copper nanoparticles without electrical isolation and the size dependence of work function [J].
Dabera, G. Dinesha M. R. ;
Walker, Marc ;
Sanchez, Ana M. ;
Pereira, H. Jessica ;
Beanland, Richard ;
Hatton, Ross A. .
NATURE COMMUNICATIONS, 2017, 8
[8]   Reactive Sintering of Cu Nanoparticles at Ambient Conditions for Printed Electronics [J].
Dai, Xiaofeng ;
Zhang, Teng ;
Shi, Hongbin ;
Zhang, Yabing ;
Wang, Tao .
ACS OMEGA, 2020, 5 (22) :13416-13423
[9]   Self-Reducible Cu Nanoparticles for Conductive Inks [J].
Dai, Xiaofeng ;
Xu, Wen ;
Zhang, Teng ;
Wang, Tao .
INDUSTRIAL & ENGINEERING CHEMISTRY RESEARCH, 2018, 57 (07) :2508-2516
[10]   Experimental and Theoretical Investigation of the Reaction of NH2 with NO at Very Low Temperatures [J].
Douglas, Kevin M. ;
Lucas, Daniel ;
Walsh, Catherine ;
Blitz, Mark A. ;
Heard, Dwayne E. .
JOURNAL OF PHYSICAL CHEMISTRY A, 2023, 127 (34) :7205-7215