The Effects of Chain Conformation and Nanostructure on the Dielectric Properties of Polymers

被引:0
作者
Mogbojuri, Gabriel [1 ]
Abtahi, Shaghayegh [1 ]
Hendeniya, Nayanathara [1 ]
Chang, Boyce [1 ]
机构
[1] Iowa State Univ, Dept Mat Sci & Engn, Ames, IA 50011 USA
关键词
dielectric polymers; breakdown strength; dielectric constant/permittivity; dielectric loss; nanocomposites; nanofillers; nanostructure; energy density; chain conformation; HIGH-ENERGY-DENSITY; PHYSICAL-PROPERTIES; HIGH-PERMITTIVITY; HIGH-TEMPERATURE; BARIUM-TITANATE; FERROELECTRIC PROPERTIES; PIEZOELECTRIC ACTIVITY; ELECTRICAL-PROPERTIES; VINYLIDENE CYANIDE; CARBON NANOTUBE;
D O I
10.3390/ma18010198
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
The dielectric properties of polymers play a pivotal role in the development of advanced materials for energy storage, electronics, and insulation. This review comprehensively explores the critical relationship between polymer chain conformation, nanostructure, and dielectric properties, focusing on parameters such as dielectric constant, dielectric loss, and dielectric breakdown strength. It highlights how factors like chain rigidity, free volume, molecular alignment, and interfacial effects significantly influence dielectric performance. Special emphasis is placed on the impact of nanofillers, molecular weight, crystallinity, and multilayer structures in optimizing these properties. By synthesizing findings from recent experimental and theoretical studies, this review identifies strategies to enhance energy efficiency, reliability, and mechanical stability of polymer-based dielectrics. We also delve into techniques such as electrostatic force microscopy (EFM) and focused ion beam (FIB) milling for characterizing breakdown mechanisms, offering insights into molecular design for next-generation high-performance polymers. Despite considerable progress, critical challenges such as achieving an optimal balance between dielectric permittivity and breakdown strength, understanding nanoscale interfacial phenomena, and scaling these materials for industrial applications persist. These gaps can be addressed by systematic structure-property relations, advanced processing techniques, and environmental studies.
引用
收藏
页数:36
相关论文
共 221 条
  • [1] The barrier effect in three-layer solid dielectrics in quasi-uniform electric field
    Agoris, DP
    Vitellas, I
    Gefle, OS
    Lebedev, SM
    Pokholkov, YP
    [J]. JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2001, 34 (24) : 3485 - 3491
  • [2] Effect of variation of different nanofillers on structural, electrical, dielectric, and transport properties of blend polymer nanocomposites
    Arya, Anil
    Sadiq, Mohd
    Sharma, A. L.
    [J]. IONICS, 2018, 24 (08) : 2295 - 2319
  • [3] Synthesis of Monodisperse TiO2-Paraffin Core-Shell Nanoparticles for Improved Dielectric Properties
    Balasubramanian, Balamurugan
    Kraemer, Kristin L.
    Reding, Nicholas A.
    Skomski, Ralph
    Ducharme, Stephen
    Sellmyer, David J.
    [J]. ACS NANO, 2010, 4 (04) : 1893 - 1900
  • [4] DEGRADATION OF POLYMERIC INSULATION DUE TO PHOTOEMISSION CAUSED BY HIGH ELECTRIC-FIELDS
    BAMJI, SS
    BULINSKI, AT
    DENSLEY, RJ
    [J]. IEEE TRANSACTIONS ON ELECTRICAL INSULATION, 1989, 24 (01): : 91 - 98
  • [5] Bar-Cohen Y., 2001, 19th AIAA Appl. Aerodyn. Conf, P1, DOI DOI 10.2514/6.2001-1492
  • [6] Bauer S, 2008, SPRINGER SER MATER S, V114, P157
  • [7] Tetracene thin film transistors with polymer gate dielectrics
    Bertolazzi, Simone
    Wuensche, Julia
    Cicoira, Fabio
    Santato, Clara
    [J]. APPLIED PHYSICS LETTERS, 2011, 99 (01)
  • [8] Quantitative analysis of piezoelectricity in simultaneously stretched and corona poled polyvinyl chloride films
    Bharti, V
    Nath, R
    [J]. JOURNAL OF APPLIED PHYSICS, 1997, 82 (07) : 3488 - 3492
  • [9] Polymer Conformation under Confinement
    Bollas, Stavros
    Chrissopoulou, Kiriaki
    Andrikopoulos, Konstantinos S.
    Voyiatzis, George A.
    Anastasiadis, Spiros H.
    [J]. POLYMERS, 2017, 9 (02)
  • [10] Boyd D.M., 1993, Polym. Electron. Photonic Appl, V467, P1