Research on Novel Thermal Management Technology in the Field of Integrated Circuits

The escalation in power density and the trend towards miniaturization in electronic devices have led to an increase in both power consumption and heat flux density in integrated circuits (ICs). This surge compromises the performance, reliability, and longevity of ICs, posing a critical threat to their operational integrity. Consequently, the advancement of integrated circuits towards greater miniaturization, enhanced integration, reduced energy consumption, and elevated performance is significantly hampered by the inefficacies of existing thermal management technologies. Traditional cooling solutions, such as air cooling, liquid cooling, and heat spreader coatings, despite providing thermal mitigation in earlier generations of IC technology, now fall short due to their high costs, low thermal conductivity efficiency, issues with thermal expansion, and environmental implications. These challenges underscore the urgent need for more efficient thermal management solutions to support the future evolution of integrated circuits. Emerging thermal management technologies, including microchannel cooling, thermoelectric cooling, advanced thermal interface materials, piezoelectric pump-driven microfluidic cooling, and three-dimensional integrated package cooling, represent promising avenues for addressing the thermal bottlenecks in IC development. This paper proposes a sustainable and effective thermal management strategy, juxtaposing traditional thermal management methodologies against these innovative technologies. Through a multidimensional comparison, it elucidates the superior efficacy of new thermal management solutions in meeting the evolving demands of integrated circuits. Furthermore, it delves into future research directions and articulates the principal challenges confronting the field.