Electrical Stress on Semiconductor Devices Mounted on PCB during Electrostatic Elimination by Corona Discharge Ionizer

被引:0
|
作者
Nakano, Aguri [1 ]
Okano, Makoto [2 ]
Terashige, Takashi [3 ]
机构
[1] Okinawa Polytech Coll, Prod Elect Informat Syst Technol, 2994-2 Ikehara, Okinawa, Okinawa 9042141, Japan
[2] Oyo Elect Co Ltd, Dev Grp, 100-29 Yoshitomi,Shisui Machi, Kikuchi, Kumamoto 8611201, Japan
[3] Hiroshima Int Univ, Dept Hlth & Wellness Sci, 5-1-1 Hiroko Shinkai, Kure, Hiroshima 7370112, Japan
关键词
semiconductor device; electrostatic hazard; electrical stress; air ionizer; static elimination;
D O I
10.1002/tee.24245
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Semiconductor devices mounted on printed circuit boards may be damaged by electrical stresses based on induced voltages due to the electric field generated by corona discharge ionizers during the static elimination, because the input line connected to the semiconductor device acts as an antenna terminating the electric field. An electrical stress sensor using an operational amplifier with an input line was mounted on a printed circuit board, in order to investigate the input line length dependence of the electrical stress due to the electric field by the ionizer. The results showed that recent scaled-down semiconductor devices may be damaged when the length of the input line exceeds 50 mm during static elimination with the corona discharge ionizer. (c) 2024 Institute of Electrical Engineers of Japan and Wiley Periodicals LLC.
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