Design, Fabrication, and Performance Optimization of a High-Temperature Thin-Film Heat Flux Sensor With a Composite Protective Layer

被引:0
作者
Lu, Meimei [1 ,2 ]
Dong, Helei [1 ,2 ]
Zheng, Yinrong [1 ,2 ]
Zhang, Juan [3 ]
Li, Xiaofen [1 ,2 ]
Tan, Qiulin [1 ,2 ]
机构
[1] North Univ China, Key Lab Micro Nano Devices & Syst, Taiyuan 030051, Peoples R China
[2] North Univ China, State Key Lab Dynam Measurement Technol, Taiyuan 030051, Peoples R China
[3] Taiyuan Inst Technol, Dept Mech Engn, Taiyuan 030008, Peoples R China
基金
中国国家自然科学基金;
关键词
Temperature sensors; Thermal resistance; Temperature distribution; Resistance; Temperature measurement; Indium tin oxide; Substrates; Annealing; Resistance heating; Plasma temperature; Composite protective layer; high temperature; indium tin oxide (ITO)/In2O3 thermopile; pulsed laser deposition (PLD); thin-film heat flux sensor (TFHFS); THERMOCOUPLE; DEPOSITION;
D O I
10.1109/TIM.2025.3529069
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
As aerospace technology continues to advance, real-time monitoring of heat flux density has become increasingly important. However, most heat flux sensors (HFSs) are unable to withstand high temperatures without water cooling, resulting in their sensitive layer films being exposed to severe oxidation or sublimation. This article proposes a composite protective layer thin-film HFS (TFHFS) based on an indium tin oxide (ITO)/In2O3 thermopile. An Al2O3-yttria-stabilized zirconia (YSZ) protective layer is deposited on top of the sensitive layer to mitigate sublimation failures caused by prolonged exposure to high temperatures. Test results indicate that the temperature resistance of the TFHFS with the protective layer is significantly enhanced, enabling it to withstand a maximum temperature of 1200(degrees)C, with response and recovery times of 1.2 and 1.3 s, respectively. Furthermore, the fabricated TFHFS exhibited excellent repeatability and high-temperature stability. However, the reliability of the leads in the designed TFHFS requires further enhancement in future studies.
引用
收藏
页数:8
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