Performance enhancement of graphite-based flexible composite phase change materials and heat dissipation characteristics of electronic devices

Phase change materials (PCM) have emerged as an effective thermal management solution for addressing the heat dissipation challenges in electronic devices, particularly those with high heat flux and prolonged thermal shock duration. However, their commercial application has been hindered by issues such as low thermal conductivity, leakage, and assembly challenges. This paper introduces composite PCM (CPCM) that offer excellent thermal conductivity, flexibility, and stable shape, developed through a process of physical mixing and thermocompression formation, and evaluates their performance in chip heat dissipation experiments. An olefin block copolymer (OBC) is used as a supporting material to encapsulate 1-hexadecanol (HD), effectively preventing melt leakage while providing thermal flexibility. Graphite is added to create interconnected heat transfer channels within the CPCM. The CPCM with 7.5 wt% expanded graphite (EG) and an HD/OBC mass ratio of 12:8 demonstrates optimal performance, achieving a thermal conductivity of 0.537 W center dot m- 1 center dot K- 1 , a phase transition enthalpy of 152J center dot g-1, and a leakage rate of only 0.846 % after 200 thermal cycles. In simulated electronic chip heat dissipation experiments, the CPCM effectively stores and dissipates heat, maintaining the electronic device within a stable and reasonable operating temperature range, thereby proving its effectiveness in the thermal management of electronic devices. The composite is easy to process, exhibits excellent performance, and holds significant potential for widespread application in the temperature control of electronic devices.