Low-Profile Self-Packaged Multimode SIW Antenna With Low-Loss Air-Bridge Interconnection

被引：1

作者：

Zhao, Jun-Zhe ^{[1
]}

Zhou, Liang ^{[1
]}

Zhang, Zi-Qi ^{[1
]}

Huang, Yin-Shan ^{[1
]}

Zhang, Cheng-rui ^{[1
]}

机构：

[1] Shanghai Jiao Tong Univ, State Key Lab Radio Frequency Heterogeneous Integr, Shanghai 200240, Peoples R China

来源：

IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS | 2025年 / 24卷 / 03期

基金：

中国国家自然科学基金;

关键词：

Broadband antennas; Antenna measurements; Substrates; Bridges; Broadband communication; Micromechanical devices; Aperture antennas; Wireless communication; Wideband; Thermal expansion; Air bridge; antenna; broadband; low profile; multimode; self-packaged; W band;

D O I：

10.1109/LAWP.2024.3510570

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This letter presents a design of a self-packaged multimode antenna at the W band. The modes of the aperture antenna are analyzed. An additive resonant mode is excited by introducing a radiation patch. A metal post is inserted in the resonance cavity to suppress an undesired mode. The multimode antenna is embedded in a silicon interposer with air bridge in wafer-level packaging. The insertion loss of the air bridge with coplanar waveguide with grounds (CPWGs) is measured. The proposed antenna is fabricated by using in-house silicon-based microelectromechanical systems (MEMS) photosensitive composite film fabrication process. The measured gain is 7 dBi at 92 GHz with an impedance bandwidth of 81.4 GHz to 109 GHz. The self-packaged antenna shows some advantages and can be further integrated with other components.

引用

页码：636 / 640

页数：5