Low-Profile Self-Packaged Multimode SIW Antenna With Low-Loss Air-Bridge Interconnection

被引：0
作者：
Zhao, Jun-Zhe [1 ]
Zhou, Liang [1 ]
Zhang, Zi-Qi [1 ]
Huang, Yin-Shan [1 ]
Zhang, Cheng-rui [1 ]
机构：
[1] Shanghai Jiao Tong Univ, State Key Lab Radio Frequency Heterogeneous Integr, Shanghai 200240, Peoples R China
来源：
IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS | 2025年 / 24卷 / 03期
基金：
中国国家自然科学基金;
关键词：
Broadband antennas; Antenna measurements; Substrates; Bridges; Broadband communication; Micromechanical devices; Aperture antennas; Wireless communication; Wideband; Thermal expansion; Air bridge; antenna; broadband; low profile; multimode; self-packaged; W band;
D O I：
10.1109/LAWP.2024.3510570
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This letter presents a design of a self-packaged multimode antenna at the W band. The modes of the aperture antenna are analyzed. An additive resonant mode is excited by introducing a radiation patch. A metal post is inserted in the resonance cavity to suppress an undesired mode. The multimode antenna is embedded in a silicon interposer with air bridge in wafer-level packaging. The insertion loss of the air bridge with coplanar waveguide with grounds (CPWGs) is measured. The proposed antenna is fabricated by using in-house silicon-based microelectromechanical systems (MEMS) photosensitive composite film fabrication process. The measured gain is 7 dBi at 92 GHz with an impedance bandwidth of 81.4 GHz to 109 GHz. The self-packaged antenna shows some advantages and can be further integrated with other components.
引用
收藏
页码：636 / 640
页数：5
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