Bio-inspired PEI/BNNS composite film via hydrogen bond self-assembly for efficiently enhancing high-temperature dielectric energy storage

被引:0
作者
Ba, Zhaotian [1 ]
Ma, Lili [1 ]
Liu, Hui [1 ]
Li, Cui [1 ]
Chen, Xuecheng [2 ]
Wen, Xin [1 ,2 ]
Song, Pingan [3 ]
Lei, Qingquan [1 ]
机构
[1] Qingdao Univ Sci & Technol, Coll Mat Sci & Engn, Qingdao 266042, Peoples R China
[2] West Pomeranian Univ Technol, Fac Chem Technol & Engn, Dept Nanomat Physicochem, Al Piastow 45, PL-70311 Szczecin, Poland
[3] Univ Southern Queensland, Ctr Future Mat, Sch Agr & Environm Sci, Springfield, Qld 4300, Australia
基金
中国国家自然科学基金;
关键词
Hydrogen bond; Interfacial self-assembly; Polyetherimide; Dielectric capacitor; Energy storage; MODEL;
D O I
10.1016/j.coco.2025.102266
中图分类号
TB33 [复合材料];
学科分类号
摘要
Polymer-based film capacitors are in high demand for modern electronic and electrical applications, but it is still challengeable to optimize their high-temperature energy storage capability. Herein, inspired by the regular alignment of fish scales, polyetherimide/BN nanosheets (PEI/BNNS) films with similar morphology were designed via hydrogen bond self-assembly process. The results indicated that the BNNS inorganic layer played important roles on suppressing carrier transport and reducing conduction loss, resulting in simultaneous improvements on dielectric and breakdown properties as well as energy storage performances. At room temperature, the highest energy density (Ue) of PEI/BNNS samples (PEI-BN4) achieved to 8.50 J cm-3 with charge/ discharge efficiency (rl) of 90.2 %, which increased by 77.1 % compared to the U e of neat PEI. At 200 degrees C, PEI-BN4 also exhibited the highest U e of 4.46 J cm- 3 with rl of 91.3 %, which was 94.8 % higher than neat PEI film (Ue = 2.29 J cm- 3 with the rl of 87.8 %). To the best of our knowledge, the energy storage performances of PEI-BN4 were better than most of currently reported high-temperature PEI-based dielectric films. The current work proposes a novel surface engineering strategy to design high-performance polymer composite film, and promote the applications of new generation of high-temperature resistant electronic devices.
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页数:9
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