Liquid-cooled Heat Dissipation Technology for Co-packaged Optics over 12.8 Tbps

With the rise of machine learning and artificial intelligence, data center power usage has increased continuously in recent years, and the bandwidth demand for switches continues to grow. As a result, the traditional pluggable optical modules with high latency and low signal quality can no longer meet the demands of bandwidth growth. As a result, co-packaged optics (CPO) technology has emerged. However, CPO introduces many new challenges, one of which is thermal management. This article explores the liquid-cooling heat dissipation technology for CPO systems over 12.8 Tbps. We designed a heat dissipation structure to address the special heat dissipation needs of CPO systems and verified the structure's excellent performance through simulation and experiment. The simulation value is reasonable and fits the experimental results. At 290W input power, the measured junction temperature of the ASIC is 51 degrees C, and the temperatures of the 16 optical chips ranged from 28 degrees C to 29 degrees C, with a maximum temperature difference of 0.6 degrees C, demonstrating the efficiency and reliability of this design.