Thermal characteristics of a compact cooling system of a powerful LED lighting device based on a spiral heat exchanger and heat pipes

In this paper, a new design of a air-cooling system of a powerful LED lighting device has been developed, which includes the use of eight radially arranged heat pipes to transfer heat from eight COB (Chip-on-Board) matrices to a heat exchange surface made in the form of a spiral heat exchanger. The spiral heat exchanger is cooled by forced air convection and is made of one continuous strip of heat-conducting material, which simplifies its production technology and ensures effective heat removal. Computer simulation made it possible to evaluate the effectiveness of the proposed cooling system for maintaining the temperature of COB matrices within acceptable values. The simulation results show that with a total thermal power of COB matrices of 500 W (62.5 W for each matrix), which is equivalent to an electrical power of about 1000 W, and the use of heat pipes with an effective thermal conductivity of over 2000 W/(m degrees C), the temperature of COB matrices does not exceed the critical value even with a minimum air flow velocity of 1 m/s and an ambient temperature of + 40 degrees C. The proposed design of the air cooling system with forced convection effectively ensures heat removal from eight COB matrices, maintaining their operating temperature within acceptable values. This contributes to increased reliability and durability of the LED lighting device while maintaining its compactness. The results obtained indicate the prospects of using spiral exchander and heat pipes with in air-cooling systems for LED devices,with input electrical power of about 1000 W.