共 50 条
Anisotropic and Heterogeneous Thermal Conductivity in Programmed Liquid Metal Composites Through Direct Ink Writing
被引:0
|作者:
Hur, Ohnyoung
[1
]
Markvicka, Eric J.
[2
,3
,4
]
Bartlett, Michael D.
[1
,5
]
机构:
[1] Virginia Tech, Mech Engn, Soft Mat & Struct Lab, Blacksburg, VA 24061 USA
[2] Univ Nebraska, Smart Mat & Robot Lab, Mech & Mat Engn, Lincoln, NE 68588 USA
[3] Univ Nebraska, Elect & Comp Engn, Lincoln, NE 68588 USA
[4] Univ Nebraska, Sch Comp, Lincoln, NE 68588 USA
[5] Virginia Tech, Macromol Innovat Inst, Blacksburg, VA 24061 USA
基金:
美国国家科学基金会;
关键词:
anisotropy;
direct ink writing;
heterogeneous;
liquid metal;
thermal conductivity;
INTERFACE MATERIALS;
MANAGEMENT;
ALIGNMENT;
D O I:
10.1002/adfm.202417375
中图分类号:
O6 [化学];
学科分类号:
0703 ;
摘要:
Thermal management in electric vehicles, electronics, and robotics requires the systematic ability to dissipate and direct the flow of heat. Thermally conductive soft composites are promising for thermal management due to their high thermal conductivity and mechanical flexibility. However, composites typically have the same microstructure throughout a film, which limits directional and spatial control of thermal management in emerging systems that have distributed heat loads. Herein, directional and spatially tunable thermal properties are programmed into liquid metal (LM) soft composites through a direct ink writing (DIW) process. Through the local control of LM droplet aspect ratio and orientation this programmable LM microstructure has a thermal conductivity in the direction of LM elongation of 9.9 W m-1<middle dot>K-1, which is similar to 40 times higher than the unfilled elastomer (0.24 W m-1<middle dot>K-1). The DIW process enables LM droplets to be oriented in specific directions with tunable aspect ratios at different locations throughout a continuous film. This introduces anisotropic and heterogeneous thermal conductivity in compliant films to control the direction and magnitude of heat transfer. This methodology and resulting materials can provide designed thermal management solutions for rigid and soft devices.
引用
收藏
页数:9
相关论文