A 6.3 dBm 258-314 GHz Power Amplifier using a Broadband 8-way SQWL Power Combiner in 130-nm SiGe BiCMOS Technology

被引:0
作者
Fu, Shouqing [1 ]
Li, Shuyang [1 ]
Li, Xingcun [2 ,3 ]
Chen, Wenhua [1 ]
机构
[1] Tsinghua Univ, Dept Elect Engn, Beijing, Peoples R China
[2] Sanechips Technol Co Ltd, Analog Design Dept, Shenzhen, Peoples R China
[3] State Key Lavoratory Mobile Network & Mobile Mult, Shenzhen, Peoples R China
来源
2024 50TH IEEE EUROPEAN SOLID-STATE ELECTRONICS RESEARCH CONFERENCE, ESSERC 2024 | 2024年
关键词
power amplifier (PA); gain-boosting; broadband; power combiner; subquarter-wavelength (SQWL) balun;
D O I
10.1109/ESSERC62670.2024.10719572
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, a 258-314 GHz power amplifier fabricated in a 130nm SiGe BiCMOS technology with f(t)/f(max)=350/450 GHz is presented. The PA employs 4 cascode amplification stages and the inductance gain-boosting method. A broadband 8-way subquarter-wavelength power combiner with compensated stepped-impedance transmission lines (TLs) is proposed to achieve wideband matching and power combining simultaneously. The circuit exhibits a peak gain of 15 dB with 56 GHz 3 -dB bandwidth. The maximum output power and OP-1dB are 63 dBm and 4.5 dBm at 270 GHz. It consumes 506 mW DC power and realizes a maximum PAE of 0.8%. The bandwidth and output power of this PA have both reached the leading level in 130-nm SiGe BiCMOS with f(max) less than 500 GHz.
引用
收藏
页码:713 / 716
页数:4
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