Integrated Design of Millimeter-wave Bandpass Filter Chip with Lumped Parameters

被引:0
作者
Chao-Cao [1 ]
Liu, Bao-Guang
Cheng, Chong-Hu
Liu, Zhi-Hao
机构
[1] Nanjing Univ Posts & Telecommun, Coll Elect & Opt Engn, Nanjing, Jiangsu, Peoples R China
来源
2024 INTERNATIONAL CONFERENCE ON MICROWAVE AND MILLIMETER WAVE TECHNOLOGY, ICMMT | 2024年
基金
中国国家自然科学基金;
关键词
bandpass filter chip; millimeter wave; lumped parameter; lntegrated design;
D O I
10.1109/ICMMT61774.2024.10671999
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
To meet the requirements of microwave technology in the millimeter wave frequency band, a tiny millimeter-wave bandpass filter chip with two transmission zero points was designed. Considering the practical application, the transfer structure with coaxial vertical transition is adopted to realize the highly integration of millimeter-wave multi-layer stereo structure. The dimension of the filter chip is 0.32 mmx0.64 mm, with the center frequency of 30 GHz and the fractional bandwidth of 18.3%. Simulation results demonstrate that the in-band return loss is greater than 12 dB, and the out-of-band suppression is 18 dB at 25 GHz and 20 dB at 35 GHZ, which essentially satisfies the specifications of a bandpass filter chip.
引用
收藏
页数:3
相关论文
共 7 条
  • [1] Chengdu Institute of Telecommunications Engineering, 1978, Design of LC Filter and Spiral Inductance Filter, P68
  • [2] LTCC Bandpass Filter With Wide Stopband Based on Electric and Magnetic Coupling Cancellation
    Dai, Xin
    Zhang, Xiu Yin
    Kao, Hsuan-Ling
    Wei, Bai-Hong
    Xu, Jin-Xu
    Li, Xiaohuan
    [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2014, 4 (10): : 1705 - 1713
  • [3] Huang Xichun, 1978, Design Principle of Filter Synthesis Method, P290
  • [4] Energy efficient degree of freedom aided multi beam transmit antenna precoding for mmWave MIMO system
    Ilango, Parthiban
    Sudha, V.
    [J]. AEU-INTERNATIONAL JOURNAL OF ELECTRONICS AND COMMUNICATIONS, 2023, 163
  • [5] Li Zhangtao, 2010, Journal of the Chinese Academy of Electronic Sciences, V5
  • [6] Taub Jess J., 1963, The Microwave journal, V6, P67
  • [7] Yang Zongbao, 2007, Electronics and packaging, V7