Effect of Trace Bismuth on Deformation Behavior of Ultrahigh-Purity Copper during Hot Compression

The effect of trace Bi impurities on the flow stress, microstructure evolution, and dynamic recrystallization (DRX) of the ultrahigh-purity copper was systematically investigated by a hot compression test at 600 degrees C. The results show that the peak stress of the ultrahigh-purity copper gradually decreases with increasing Bi content. Trace Bi impurities can refine the microstructure of ultrahigh-purity copper. However, the refinement effect of 50 wt ppm Bi is much more significant than that of 140 wt ppm Bi during the hot deformation. This effect is ascribed to the higher concentration of Bi at GBs, which induces severe GB cracks that reduces the driving force for the nucleation of DRX grains. In addition, the introduction of Bi inhibits the DRX of the ultrahigh-purity copper and transforms its DRX process from the discontinuous dynamic recrystallization (DDRX) to the coexistence of DDRX and continuous dynamic recrystallization (CDRX) mechanisms.