Study on the Ultrasonic Bonding Process Using Molecular Dynamics Simulation

We performed ultrasonic bonding simulation by the molecular dynamics method. The purpose of this study is to elucidate the mechanism of the ultrasonic bonding process and optimize the bonding process by using molecular dynamics. It was shown that transverse vibration allows bonding at lower pressure than vibration-free bonding. The faster the transverse vibration, the lower the required pressure, but the atomic structure becomes unstable. The slower the transverse vibration, the more wavy and more stable the bonding interface becomes, but higher bonding pressure is required. Among the examined conditions, we determined the most appropriate condition for ultrasonic bonding.