MODEL DEVELOPMENT OF MANUFACTURING INFORMATION SYSTEM FOR SILICON CARBIDE WAFER PRODUCTION

被引:0
作者
Fatoki, Olukayode [1 ]
Li, Zhichao [1 ]
机构
[1] North Carolina Agr & Tech State Univ, Dept Ind & Syst Engn, Greensboro, NC 27411 USA
来源
PROCEEDINGS OF ASME 2024 19TH INTERNATIONAL MANUFACTURING SCIENCE AND ENGINEERING CONFERENCE, MSEC2024, VOL 2 | 2024年
关键词
Chemical mechanical planarization; Crystal Growth; Data tracking; Epitaxy; Grinding; Information system; Semiconductor; Silicon Carbide; Slicing; Wafer fabrication; GAN;
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Silicon carbide (SiC) has emerged as a highly promising semiconductor material, driving demand for SiC wafers. Establishing robust manufacturing processes is crucial for efficient production and delivering high-quality SiC wafers. This paper focuses on developing a comprehensive manufacturing information system model tailored for SiC wafer production for the first time. The model aims to guide manufacturing processes and provide a panoramic view of operations. It dissects the SiC wafer fabrication process into three flow components: data flow, material flow, and process flow. First, the process flow is re-investigated to map out manufacturing steps. Equipment, process, and consumable are employed as key parameters for precise information tracking. Second, the material flow is systematically analyzed to trace the change of material form, properties, and wafer manufacturing specifications. Therefore, more comprehensive data can be collected and stored efficiently. The data flow involves collecting and categorizing information on a series of IDs such as order ID, production batch ID, boule ID, and wafer ID etc. Exemplary entities and their attributes in each flow are proposed and identified, respectively. The relationship within flow and between flows is demonstrated using the crow's foot model. Based on the model, an innovative information system is proposed for SiC fabrication and the semiconductor industry. The model will offer a potent tool for process guidance, data-driven decision-making, and a comprehensive overview of SiC wafer manufacturing operations. It will empower semiconductor manufacturers to navigate complexities with precision and confidence.
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页数:8
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