On the characterization of MPA CVD diamond for fracture toughness measurements

被引:0
|
作者
Aiello, Gaetano [1 ]
Bonnekoh, Carsten [1 ]
Gabrusenoks, Jevgenijs [2 ]
Gorr, Bronislava [1 ]
Meier, Andreas [1 ]
Popov, Anatoli, I [2 ]
Scherer, Theo [1 ]
Schreck, Sabine [1 ]
Seemann, Klaus [1 ]
Strauss, Dirk [1 ]
Wild, Christoph [3 ]
Woerner, Eckhard [3 ]
机构
[1] Karlsruhe Inst Technol, Inst Appl Mat, Karlsruhe, Germany
[2] Univ Latvia, Inst Solid State Phys, Riga, Latvia
[3] Diamond Mat GmbH & Co KG, Freiburg, Germany
来源
2024 49TH INTERNATIONAL CONFERENCE ON INFRARED, MILLIMETER, AND TERAHERTZ WAVES, IRMMW-THZ 2024 | 2024年
关键词
EC systems; CVD diamond; diamond windows; fracture toughness; microfeatures;
D O I
10.1109/IRMMW-THz60956.2024.10697823
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Failure due to crack propagation is the crucial failure mode of the optical quality polycrystalline diamond disks, which are used as safety and vacuum barriers in the electron cyclotron systems of nuclear fusion devices. This paper reports on the characterization of preliminary polycrystalline diamond samples for experimental measurements of the diamond fracture toughness by the double-torsion method.
引用
收藏
页数:2
相关论文
共 50 条
  • [21] Monitoring degradation of poly(hydroxybutyrate) by fracture toughness measurements
    Hobbs, JK
    Sykes, KE
    McMaster, TJ
    Barham, PJ
    JOURNAL OF ENVIRONMENTAL POLYMER DEGRADATION, 1996, 4 (04): : 235 - 241
  • [22] Effects of Diamond on Microstructure, Fracture Toughness, and Tribological Properties of TiO2-Diamond Composites
    Liu, Bing
    Zhuge, Zewen
    Zhao, Song
    Zou, Yitong
    Tong, Ke
    Sun, Lei
    Wang, Xiaoyu
    Liang, Zitai
    Li, Baozhong
    Jin, Tianye
    Chen, Junyun
    Zhao, Zhisheng
    NANOMATERIALS, 2022, 12 (21)
  • [23] Fracture Toughness of Weld Metal of 440 MPa Grade High-strength Steel
    Zeng D.
    An T.
    Zheng S.
    Dai H.
    Cao Z.
    Ma C.
    Cailiao Yanjiu Xuebao/Chinese Journal of Materials Research, 38 (02): : 151 - 160
  • [24] In-situ measurements of fracture toughness and microstructure characterization of C/SiC composites at elevated temperatures in air
    Chen W.
    Wang L.
    Zhang H.
    Li G.
    Chi P.
    Ma J.
    Baozha Yu Chongji/Explosion and Shock Waves, 2021, 41 (04):
  • [25] Exploring three-point-bending fracture toughness of thick diamond films from different directions
    An, Kang
    Liu, Peng
    Shao, Siwu
    Li, Haixia
    Yang, Zhiliang
    Zhang, Shuai
    Li, Shiyu
    Huang, Yabo
    Liu, Jinlong
    Chen, Liangxian
    Wei, Junjun
    Zheng, Yuting
    Liu, Qing
    Liu, Fengbin
    Li, Chengming
    SURFACE & COATINGS TECHNOLOGY, 2022, 448
  • [26] Characterization of CVD Diamond Thin Film Electrodes in Terms of their Semiconductivity
    Yu. V. Pleskov
    M. D. Krotova
    V. V. Elkin
    V. P. Varnin
    I. G. Teremetskaya
    Electrocatalysis, 2013, 4 : 241 - 244
  • [27] Characterization of CVD Diamond Thin Film Electrodes in Terms of their Semiconductivity
    Pleskov, Yu V.
    Krotova, M. D.
    Elkin, V. V.
    Varnin, V. P.
    Teremetskaya, I. G.
    ELECTROCATALYSIS, 2013, 4 (04) : 241 - 244
  • [28] Electrical characterization of CVD diamond-n+ silicon junctions
    Rodrigues, AM
    Gomes, HL
    Stallinga, P
    Pereira, L
    Pereira, E
    DIAMOND AND RELATED MATERIALS, 2001, 10 (3-7) : 858 - 862
  • [29] FRACTURE-TOUGHNESS OF TIC-SIC COMPOSITES FABRICATED BY CVD AND THE MECHANISM OF TOUGHENING
    KAWAI, C
    SUZUKI, K
    TANAKA, K
    NIPPON SERAMIKKUSU KYOKAI GAKUJUTSU RONBUNSHI-JOURNAL OF THE CERAMIC SOCIETY OF JAPAN, 1992, 100 (06): : 835 - 840
  • [30] In-situ measurements of fracture toughness properties in composite laminates
    Nikishkov, Yuri
    Seon, Guillaume
    Makeev, Andrew
    Shonkwiler, Brian
    MATERIALS & DESIGN, 2016, 94 : 303 - 313