NanoCoating Preparation to Improve Heat Dissipation of a Heat Sink Inside an Enclosure for Power Electronic Devices

Heat sinks dissipate heat from electronic components, and the increase in heat generation owing to technological advancements has prompted researchers to improve heat sink efficiency. The present study aims to improve heat sinks by high-emissivity nanocoating where the coating is prepared using nanoparticles CuO and MWCNT at a rate of 6% in half a liter of Acrylic resin and solvents Xylene and Butyl acetate at a rate of 30%. After coating the heat sink, the emissivity was examined and it was (0.963) while it was before coating (0.202). The heat sink is examined inside a cubic cavity with a right surface containing heaters that give temperature at the same value as the thyristors (58.5 degrees C, 90 degrees C, and 112.5 degrees C) and a cold left surface (30 degrees C). The temperatures at the tip of each fin are measured before and after coating when they change with time and at a steady state. The results showed that the nanocoating significantly reduced the temperature compared to the uncoated condition with the improvement percentage at a heater temperature of 58.5 degrees C ranging from 10% to 15% at 90 degrees C ranging from 24% to 34% and at 112.5 degrees C ranging from 23% to 35%. It is concluded that the nanocoating showed great effectiveness in improving the performance of the heat sink at all temperatures, but the maximum effectiveness was at high thermal loads.