Effect of electrically aligned polycrystalline diamond flakes on the through-plane thermal conductivity of heat conduction sheets

被引:0
作者
Inaba, Masafumi [1 ]
Seike, Seiya [2 ]
Chen, Yingchen [2 ]
Ichiki, Soichiro [2 ]
Kubota, Yoshihiko [2 ]
Ohmagari, Shinya [3 ]
Nakano, Michihiko [1 ]
Suehiro, Junya [1 ]
机构
[1] Kyushu Univ, Fac Informat Sci & Elect Engn, Fukuoka, Japan
[2] Kyushu Univ, Grad Sch Informat Sci & Elect Engn, Fukuoka, Japan
[3] Natl Inst Adv Ind Sci & Technol, Sensing Syst Res Ctr SSRC, Tosu, Japan
来源
FUNCTIONAL DIAMOND | 2024年 / 4卷 / 01期
基金
日本学术振兴会;
关键词
Composites; diamond film; hot-filament chemical vapor deposition; thermal properties; BORON-NITRIDE NANOSHEETS; POLYMER COMPOSITES; FILMS; MANAGEMENT; ALIGNMENT;
D O I
10.1080/26941112.2024.2423643
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Heat conduction sheets, which are composed of a thermally conductive filler and a base elastomer matrix, are important for dissipating heat from devices to a heat sink. Alignment of the heat-conducting two-dimensional filler particles enhances the thermal conductivity of the heat conduction sheet. In this study, we prepared polycrystalline diamond (PCD) flakes and then electrically aligned the PCD flakes in the through-plane direction of heat conduction sheet samples. The PCD flakes were fabricated by pulverizing a synthesized PCD thin layer. The typical size of the PCD flakes was similar to 1 mu m in thickness and similar to 35 mu m in diameter. The PCD flakes were electrically aligned in a polydimethylsiloxane (PDMS) matrix by applying alternating high voltage with parallel-plate electrodes. The heat conduction sheet containing 20 wt% aligned PCD flakes in the matrix exhibited high through-plane thermal conductivity of 0.47 W m-1 K-1, while that of the heat conduction sheet with aligned granular diamond filler particles was 0.37 W m-1 K-1. The high thermal conductivity comes from the formation of a large contact area between the filler particles and flake network by electrical alignment in the heat conduction sheet.
引用
收藏
页数:9
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共 44 条
[1]  
ASTM, 2001, D547-01, standard test method for thermal transmission properties of thin thermally conductive solid electrical insulation materials
[2]   Review of thermal conductivity in composites: Mechanisms, parameters and theory [J].
Burger, N. ;
Laachachi, A. ;
Ferriol, M. ;
Lutz, M. ;
Toniazzo, V. ;
Ruch, D. .
PROGRESS IN POLYMER SCIENCE, 2016, 61 :1-28
[3]   Thermal conductivity of polymer-based composites: Fundamentals and applications [J].
Chen, Hongyu ;
Ginzburg, Valeriy V. ;
Yang, Jian ;
Yang, Yunfeng ;
Liu, Wei ;
Huang, Yan ;
Du, Libo ;
Chen, Bin .
PROGRESS IN POLYMER SCIENCE, 2016, 59 :41-85
[4]   Vertically Aligned and Interconnected Boron Nitride Nanosheets for Advanced Flexible Nanocomposite Thermal Interface Materials [J].
Chen, Jin ;
Huang, Xingyi ;
Sun, Bin ;
Wang, Yuxin ;
Zhu, Yingke ;
Jiang, Pingkai .
ACS APPLIED MATERIALS & INTERFACES, 2017, 9 (36) :30909-30917
[5]   Ultra high thermal conductivity polymer composites [J].
Chen, YM ;
Ting, JM .
CARBON, 2002, 40 (03) :359-362
[6]   Thermal conductivity of carbon nanotubes and their polymer nanocomposites: A review [J].
Han, Zhidong ;
Fina, Alberto .
PROGRESS IN POLYMER SCIENCE, 2011, 36 (07) :914-944
[7]   Electric-field-assisted fabrication of metal-class thermal-conductive and elastomer-class-flexible composites comprising plasma-surface-modified hexagonal boron nitride and polyrotaxane [J].
Hasegawa, Rui ;
Inoue, Kenichi ;
Muneoka, Hitoshi ;
Ito, Tsuyohito ;
Kirihara, Kazuhiro ;
Shimizu, Yoshiki ;
Hakuta, Yukiya ;
Ito, Kohzo ;
Terashima, Kazuo .
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2024, 184
[8]   Thermal conductivity of platelet-filled polymer composites [J].
Hill, RF ;
Supancic, PH .
JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 2002, 85 (04) :851-857
[9]   Polymer Composite with Improved Thermal Conductivity by Constructing a Hierarchically Ordered Three-Dimensional Interconnected Network of BN [J].
Hu, Jiantao ;
Huang, Yun ;
Yao, Yimin ;
Pan, Guiran ;
Sun, Jiajia ;
Zeng, Xiaoliang ;
Sun, Rong ;
Xu, Jian-Bin ;
Song, Bo ;
Wong, Ching-Ping .
ACS APPLIED MATERIALS & INTERFACES, 2017, 9 (15) :13544-13553
[10]   Oriented BN/Silicone rubber composite thermal interface materials with high out-of-plane thermal conductivity and flexibility [J].
Hu, Qinghua ;
Bai, Xue ;
Zhang, Chenxu ;
Zeng, Xiaoliang ;
Huang, Zhengyong ;
Li, Jian ;
Li, Junwei ;
Zhang, Yuexing .
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2022, 152