Increasing of Deformation Strength: Evaluating of Local Heating on Selective Laser-Melted AlSi10Mg

This study investigated the deformation resistance of selective laser melting AlSi10Mg against the applied load and its behavior against bending after local heating. In experimental studies, the bending region of the samples was heated locally at temperatures of 300, 400, and 500 degrees C and then deformed in V bending dies of 6, 7.5, 9, and 15 degrees. It was observed that the deformation resistance of the samples was sufficient in the dies of 6, 7.5, and 9 degrees and at all temperatures. Therefore, the samples did not flex or break successfully. However, it was observed that at a die angle of 15, only the test samples at RT and 300 degrees C showed sufficient deformation resistance and flexed successfully, while at 400 and 500 degrees C temperatures, they could not withstand deformation and broke. The study also examined the effect of district heating temperature on the microstructure. In as-built samples, it was observed that the microstructure was centric at room temperature (RT), and the microhardness value was 131 HV. At the regional heating temperature of 300 degrees C, it was observed that there was no significant change in the microstructure, and the microhardness value was measured as 130 HV. However, at 400 degrees C regional heating, it was determined that the dendritic structure started to be replaced by precipitated Si particles, and the microhardness value decreased to 127 HV. It was determined that at 500 degrees C, the microhardness value decreased to 125 HV due to the growth of the grain structure in the microstructure.