SiC-substrate Uni-traveling-carrier Photodiode Modules for 300-GHz-band Wireless Communications

被引：0

作者：

Nagatsuma, Tadao ^{[1
,2
]}

Ohara, Takahiro ^{[1
]}

Kawamoto, Yuma ^{[1
]}

Maekawa, Keisuke ^{[1
]}

Ishibashi, Tadao ^{[3
]}

机构：

[1] Osaka Univ, Grad Sch Engn Sci, Toyonaka, Osaka, Japan

[2] Univ Tokyo, Grad Sch Sci, Tokyo, Japan

[3] Wavepackets LLC, Atsugi, Kanagawa, Japan

来源：

2024 49TH INTERNATIONAL CONFERENCE ON INFRARED, MILLIMETER, AND TERAHERTZ WAVES, IRMMW-THZ 2024 | 2024年

关键词：

photodiode; SiC; wireless communication; dielectric waveguide;

D O I：

10.1109/IRMMW-THz60956.2024.10697890

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents an efficient integration of SiC-substrate uni-traveling-carrier photodiodes (UTC-PDs) with Si dielectric waveguides for broadband high-power transmitters in the 300-GHz band, and demonstrates the first successful experiment of wireless communications at data rates of over 200 Gbit/s.

引用

页数：2