Study on short-circuit characteristics of semi-super-junction SiC MOSFETs

被引:0
|
作者
Zhu, Houbai [1 ]
Luo, Houcai [1 ]
Wang, Jialu [1 ]
He, Yujuan [1 ]
Wang, Ye [1 ]
Chen, Xianping [1 ]
机构
[1] Chongqing Univ, Key Lab Optoelect Technol & Syst, Chongqing, Peoples R China
来源
2024 25TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT | 2024年
基金
中国国家自然科学基金;
关键词
2D numerical simulation; short-circuit characteristics; SiC MOSFET; semi-super-junction;
D O I
10.1109/ICEPT63120.2024.10668461
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this paper, the short-circuit (SC) characteristics of conventional and semi-super-junction (semi-sj) SiC MOSFETs are investigated using 2D numerical simulation, revealing a possible short-circuit failure mechanism and performance degradation mechanism of SiC MOSFET. Comparing the short-circuit characteristics of the two devices, it is found that the semi-sj SiC MOSFET exhibits superior short-circuit characteristics and relatively weak performance degradation due to the introduction of the P-pillar region. Meanwhile, combined with the static characterization of the devices, it is found that the semi-sj SiC MOSFET has better overall performance. In addition, the short-circuit reliability of semi-sj SiC MOSFETs can be further optimized concerning device structural parameters such as the thickness and doping concentration of the N-type bottom auxiliary layer and the thickness of the gate oxide layer.
引用
收藏
页数:5
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