Effect of grain size and orientation on magnetron sputtering yield of tantalum

被引:0
|
作者
Yu, Kai [1 ]
Xue, Xin [1 ]
Xu, Longfei [1 ]
Li, Guipeng [2 ]
Zhang, Xiaodan [3 ]
Wang, Yuhui [1 ]
机构
[1] Yanshan Univ, Natl Engn Res Ctr Equipment & Technol Cold Strip R, Sch Mech Engn, Qinhuangdao 066004, Peoples R China
[2] Tong Chuang Special Mat Co Ltd, Lishui 323000, Peoples R China
[3] Tech Univ Denmark, Dept Civil & Mech Engn, DK-2800 Lyngby, Denmark
来源
INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS | 2025年 / 126卷
关键词
Tantalum target; electron beam melting; Sputtering rate; Deposition rate; Grain size and orientation; SURFACE-MORPHOLOGY; DIFFUSION BARRIER; PERFORMANCE; TEXTURE; FILMS;
D O I
10.1016/j.ijrmhm.2024.106948
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The electron beam melting (EBM) technique was employed to prepare ultra-highly pure (99.999 wt%) Tantalum (Ta) cast ingot for application in chips. Subsequently, the Ta cast ingot were forged, rolled, and annealed with different durations to gain three different grain sizes (centimeter scale, 99.8 mu m, and 36.7 mu m). Sputtering experiments conducted under identical conditions revealed that the rolled target (36.7 mu m) film deposition rate was increased by 60.6 % compared to the cast ingot target with a centimeter-scale grain size (columnar crystal). Ta targets with a fine grain size and homogeneous distribution demonstrate superior film deposition performance. The sputtering rate is directly related to the atomic packing density of grains. The (111)-oriented grains of BCC targets (Ta target) exhibit sputtering resistance, and the order of sputtering rate of Ta atoms was S-(101) > S-(001) > S-(111).
引用
收藏
页数:8
相关论文
共 50 条
  • [1] Effect of grain orientation on tantalum magnetron sputtering yield
    Zhang, Z.
    Kho, Ling
    Wickersham, C. E., Jr.
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2006, 24 (04): : 1107 - 1111
  • [2] Comprehensive effect of grain size and original target morphology on sputtering behavior of magnetron sputtering target
    Yi, Chen-Xi
    Zhang, Hao-Tian
    Wang, Shuai-Kang
    Han, Gui-Sheng
    Liu, Zhi-Ling
    Tian, Ye-Fei
    Bao, Ming-Dong
    VACUUM, 2023, 210
  • [3] Magnetron sputtering of films with controlled texture and grain size
    Musil, J
    Vlcek, J
    MATERIALS CHEMISTRY AND PHYSICS, 1998, 54 (1-3) : 116 - 122
  • [4] EFFECT OF ORIENTATION ON GRAIN SIZE DEPENDENCE OF YIELD STRENGTH OF METALS
    SMITH, E
    WORTHINGTON, PJ
    PHILOSOPHICAL MAGAZINE, 1964, 9 (98): : 211 - &
  • [5] Growth of tantalum boride films by RF magnetron sputtering - Effect of bias
    Lin, ST
    Lee, C
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2003, 150 (10) : G607 - G611
  • [6] Synthesis of thin tantalum films by magnetron sputtering
    V. A. Luzanov
    A. S. Vedeneev
    V. V. Ryl’kov
    M. P. Temiryazeva
    A. M. Kozlov
    M. P. Dukhnovskii
    A. S. Bugaev
    Journal of Communications Technology and Electronics, 2015, 60 : 1325 - 1327
  • [7] Synthesis of thin tantalum films by magnetron sputtering
    Luzanov, V. A.
    Vedeneev, A. S.
    Ryl'kov, V. V.
    Temiryazeva, M. P.
    Kozlov, A. M.
    Dukhnovskii, M. P.
    Bugaev, A. S.
    JOURNAL OF COMMUNICATIONS TECHNOLOGY AND ELECTRONICS, 2015, 60 (12) : 1325 - 1327
  • [8] Correlating discrete orientation and grain size to the sputter deposition properties of tantalum
    Christopher A. Michaluk
    Journal of Electronic Materials, 2002, 31 : 2 - 9
  • [9] Correlating discrete orientation and grain size to the sputter deposition properties of tantalum
    Michaluk, CA
    JOURNAL OF ELECTRONIC MATERIALS, 2002, 31 (01) : 2 - 9
  • [10] Influence of grain size of Cu target on its magnetron sputtering erosion and parameters
    Yang, Wenhao
    Zhao, Guohua
    Wang, Yupeng
    Wang, Shuaikang
    Zhan, Shangsong
    Wang, Duo
    Bao, Mingdong
    Tang, Bin
    Yao, Lijun
    Wang, Xueze
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 32 (21) : 26181 - 26188