Development of Electrically Conductive Buffer for REBCO Conductors

被引:0
作者
Sayeed, Md Abu [1 ]
Paulose, Manoj [1 ]
Sandra, Jithin sai [1 ]
Sherin, Susancy [1 ]
Prabhakaran, Abhin [1 ]
Sharma, Sahil [1 ]
Selvamanickam, Venkat [1 ]
机构
[1] Univ Houston, Adv Mfg Inst, Texas Ctr Superconduct, Dept Mech Engn, Houston, TX 77204 USA
关键词
Current sharing; electrical resistivity; epitaxy; superconductor; sputtering; FILMS; TIN;
D O I
10.1109/TASC.2025.3530334
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
An electrically conductive buffer architecture can enable defect-tolerant RE-Ba-Cu-O (REBCO) superconductor tapes by providing a current shunt path to the substrate. We are developing suitable electrically conductive buffers based on Titanium Nitride (TiN) grown on an ion beam-assisted deposition (IBAD) template on Hastelloy C276 substrate. The aim is to prevent the oxidation of TiN during metal-organic chemical vapor deposition (MOCVD) of REBCO. The buffer architecture was modified to render TiN more oxidation-resistant while maintaining good electrical conductivity. A strong biaxial texture was achieved and a low electrical resistivity of 43 mu ohm cm was measured with this modified buffer architecture. An oxide layer based on the SrTiO3 (STO) cap layer was epitaxially grown using RF magnetron sputtering followed by REBCO film growth by MOCVD. By avoiding oxidation of the modified buffer architecture based on TiN, we achieved a strong epitaxy of REBCO with a sharp texture, without non-00L orientations. Scanning Hall Probe Microscopy (SHPM) data showed uniformly high critical current density throughout the entire REBCO tape.
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页数:4
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