Vibro-acoustic suppression in metamaterial sandwich plate using compressional-torsional coupling resonator

被引:0
作者
Zhang, Rui [1 ]
Ding, Wei [1 ]
Liu, Hao [1 ]
Feng, Peicheng [1 ]
Ding, Weizhe [1 ]
Chen, Tianning [1 ,2 ]
Zhu, Jian [1 ,2 ]
机构
[1] Xi An Jiao Tong Univ, Sch Mech Engn, Xian 710049, Shaanxi, Peoples R China
[2] Xi An Jiao Tong Univ, State Key Lab Strength & Vibrat Mech Struct, Xian 710049, Shaanxi, Peoples R China
基金
中国博士后科学基金; 中国国家自然科学基金;
关键词
Metamaterial; Vibro-acoustic suppression; Bandgap; Sandwich structure; Inertial amplification; Compressional-torsional coupling; INERTIAL AMPLIFICATION; LOW-FREQUENCY; BAND-GAPS; VIBRATION; DESIGN; COMPOSITE; BEAMS;
D O I
10.1016/j.ijmecsci.2025.110039
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
Reducing low-frequency vibration and sound radiation in lightweight sandwich structures remains a significant challenge due to the inherently long wavelength of low-frequency waves. In this study, we proposed a novel metamaterial sandwich plate with compressional-torsional coupling inertial amplification resonators to effectively attenuate low-frequency vibration and suppress sound radiation. The sandwich plate is integrally fabricated by 3D printing technology. A theoretical model for bandgap prediction is developed using Hamilton's principle. Theoretical, numerical, and experimental results converge to demonstrate that the proposed metamaterial sandwich plate exhibits superior low-frequency bandgap performance while ensuring the lightweight and compactness of the structure. The bandgap starting frequency of the compressional-torsional coupling resonator is 45 % lower than that of the conventional resonator, despite having identical mass and stiffness. Moreover, for the same bandgap starting frequency and stiffness, its mass is only 30 % of that of the conventional counterpart. Crucially, it also occupies significantly less space compared to the lever-type inertial amplification local resonator. This work introduces a promising strategy for the reduction of low-frequency vibration in engineering applications.
引用
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页数:19
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