Enrichment Methods for Metal Recovery from Waste from Electrical and Electronic Equipment: A Brief Review

被引:0
作者
Chicardi, Ernesto [1 ]
Lopez-Paneque, Antonio [2 ]
Garcia-Orta, Victoria Humildad Gallardo [3 ]
Sepulveda-Ferrer, Ranier Enrique [1 ]
Gallardo, Jose Maria [1 ]
机构
[1] Univ Seville, Escuela Tecn Super Ingn, Dept Ingn & Ciencia Mat & Transporte, Camino Descubrimientos S-N, Seville 41092, Spain
[2] Asociac Invest & Cooperac Ind Andalucia AICIA, Camino Descubrimientos S-N, Seville 41092, Spain
[3] Atlantic Copper SLU, Francisco Montenegro Ave, Huelva 21001, Spain
关键词
WEEE; PCBs; metal recovery; electrostatic separation; shredder; magnetic separation; cryomilling; PRINTED-CIRCUIT-BOARDS; EDDY-CURRENT SEPARATOR; NONMETALLIC FRACTIONS; FROTH FLOTATION; LIBERATION CHARACTERISTICS; PHYSICAL SEPARATION; COMMINUTION FINES; MOBILE PHONES; PARTICLES; BENEFICIATION;
D O I
10.3390/met15020140
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The growing global demand for minerals and metals, coupled with fluctuations in pricing and market disruptions, has emphasised the critical role of these resources in sustaining the global economy. Waste from Electrical and Electronic Equipment (WEEE) has emerged as a promising source of raw materials, particularly for metal recycling and the valorisation of plastic fractions. In 2022, approximately 62 million metric tons of e-waste were generated worldwide, with projections indicating a rise to 74 million metric tons by 2030. Despite the significant volume of WEEE, only 17.4% was collected and recycled, which reveals a considerable opportunity for resource recovery. This review highlights the composition of metals in WEEE, which includes valuable precious metals, such as gold, silver, and palladium, alongside base metals, such as copper and aluminium. The review also discusses current methodologies for metal recovery and focuses on mechanical size-reduction techniques and various physical separation methods, including a shaking table, magnetic, electrostatic, and eddy current separation, flotation, and the use of a hydrocyclone. These technologies play a vital role in enhancing recovery efficiencies, thereby contributing to sustainable practices in the recycling industry. Thus, the works evaluated in this paper reveal the possibility of recovering more than 90 wt.% of precious (Ag, Au, Pd, Pt) and main metals (Cu, Sn, Al, Fe, Ni) by a combination of these mechanical size-reduction and physical separation methods.
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页数:19
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  • [1] Hubau A., Chagnes A., Minier M., Touze S., Chapron S., Guezennec A.G., Recycling-oriented methodology to sample and characterize the metal composition of waste Printed Circuit Boards, Waste Manag, 91, pp. 62-71, (2019)
  • [2] Charitopoulou M.A., Kalogiannis K.G., Lappas A.A., Achilias D.S., Novel trends in the thermo-chemical recycling of plastics from WEEE containing brominated flame retardants, Environ. Sci. Pollut. Res, 28, (2021)
  • [3] Achilias D.S., Antonakou E.V., Chemical and Thermochemical Recycling of Polymers from Waste Electrical and Electronic Equipment, in: Recycling Materials Based on Environmentally Friendly Techniques, (2015)
  • [4] Martelo L.M., Bastos M.M.S.M., Soares H.M.V.M., Separation of the metallic and non-metallic fractions of waste printed circuit boards—A review focused on the organic swelling, Miner. Eng, 206, (2024)
  • [5] Adrian S., Drisse M.B., Cheng Y., Devia L., Deubzer O., Goldizen F., Gorman J., Herat S., Honda S., Iattoni G., Et al., Quantities, flows, and the circular economy potential, Glob. E-Waste Monit, 2020, pp. 13-15, (2020)
  • [6] Tiwary C.S., Kishore S., Vasireddi R., Mahapatra D.R., Ajayan P.M., Chattopadhyay K., Electronic waste recycling via cryo-milling and nanoparticle beneficiation, Mater. Today, 20, pp. 67-73, (2017)
  • [7] Balde C.P., Kuehr R., Yamamoto T., McDonald R., Althaf S., Bel G., Deubzer O., Fernandez-Cubillo E., Forti V., Gray V., Et al., The Global E-Waste Monitor 2024, (2024)
  • [8] Hadi P., Gao P., Barford J.P., McKay G., Novel application of the nonmetallic fraction of the recycled printed circuit boards as a toxic heavy metal adsorbent, J. Hazard. Mater, 252–253, pp. 166-170, (2013)
  • [9] Wang H., Zhang G., Hao J., He Y., Zhang T., Yang X., Morphology, mineralogy and separation characteristics of nonmetallic fractions from waste printed circuit boards, J. Clean. Prod, 170, pp. 1501-1507, (2018)
  • [10] Gallegos-Acevedo P.M., Espinoza-Cuadra J., Olivera-Ponce J.M., Conventional flotation techniques to separate metallic and nonmetallic fractions from waste printed circuit boards with particles nonconventional size, J. Min. Sci, 50, pp. 974-981, (2014)