Influence of Undercooling on the Solidification Behaviour and Microstructure of Non-equilibrium Solidification of Cu-based Alloys

The evolution of the microstructure and morphology of Cu55Ni45 and Cu60Ni40 alloys under varying degrees of undercooling was investigated through molten glass purification and cyclic superheating technology. By increasing the Cu content, the effect of Cu on the evolution of the microstructure and morphology of the Cu-Ni alloy during undercooling was studied. The mechanism of grain refinement at different degrees of undercooling and the effect of Cu content on its solidification behaviour were investigated. The solidification behaviour of Cu55Ni45 and Cu60Ni40 alloys was investigated using infrared thermometry and high-speed photography. The results indicate that both Cu55Ni45 and Cu60Ni40 alloy melts undergo only one recalescence during rapid solidification. The degree of recalescence increases approximately linearly with increasing undercooling. The solidification front of the alloy melts undergoes a transition process from a small-angle plane to a sharp front and then to a smooth arc. However, the growth of the subcooled melt is constrained to a narrow range, facilitating the formation of a coarse dendritic crystal morphology in the Cu-Ni alloy. At large undercooling, the stress breakdown of the directionally growing dendrites is primarily caused by thermal diffusion. The strain remaining in the dendritic fragments provides the driving force for recrystallisation of the tissue to occur, which in turn refines the tissue.