Stability Improvement of GaN Power HEMT by a Multifunctional Monolithic Protection Circuit

被引:0
作者
Song, Qihao [1 ]
Yang, Xin [1 ]
Wang, Bixuan [1 ]
Litchford, Everest [1 ]
Sun, Yi [2 ]
Kong, Pengju [2 ]
Li, Qiang [1 ]
Zhang, Yuhao [3 ,4 ]
机构
[1] Virginia Polytech Inst & State Univ, Ctr Power Elect Syst, Blacksburg, VA 24060 USA
[2] Innosci Amer, Santa Clara, CA 95054 USA
[3] Virginia Tech, Blacksburg, VA 24060 USA
[4] Univ Hong Kong, Dept Elect & Elect Engn, Hong Kong, Peoples R China
关键词
HEMTs; Logic gates; Electrostatic discharges; Circuit stability; Switching circuits; Power electronics; Stress; MODFETs; Gate drivers; Stability criteria; Dynamic on-resistance; electrostatic discharge (ESD); GaN; gate driver; high electron mobility transistor (HEMT); power electronics; power semiconductor devices; reliability; stability; threshold voltage; THRESHOLD VOLTAGE INSTABILITY; DYNAMIC ON-RESISTANCE; BREAKDOWN; RELIABILITY; DEGRADATION; MECHANISMS;
D O I
10.1109/TPEL.2024.3510060
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This work presents a gate electrostatic discharge (ESD) protection circuit monolithically integrated with the GaN power high-electron-mobility-transistor (HEMT). In addition to enhancing the gate robustness against the ESD event, this multifunctional circuit also improves the stability of on-resistance (R-ON) and threshold voltage (V-TH) when power HEMT is under normal switching operations. Such improvement is enabled by clamping the HEMT's negative gate bias (V-G) at the off state, which is a critical cause of the R-ON and V-TH instabilities in power p-gate GaN HEMTs. A circuit setup is deployed for the in situ monitoring of the dynamic R-ON and its evolution from the first switching cycle to the steady state. Under the off-state stress with negative V-G and high drain bias (V-D), the GaN HEMT without ESD circuit shows a drastic dynamic R-ON increase in the first tens of switching cycles. Such a phenomenon is fully suppressed by the ESD protection circuit. In addition, the longer-term stability of R-ON and V-TH is tested under the prolonged stresses of V-G and V-D, in which the device with an ESD circuit shows superior stability. Physics-based technology-aided computer design simulation unveils the critical physics accounting for such stability improvement. These results reveal a new pathway to address the p-gate GaN HEMTs' inherent instability while simultaneously boosting their gate robustness.
引用
收藏
页码:5212 / 5222
页数:11
相关论文
共 51 条
  • [1] ESD-failure of E-mode GaN HEMTs: Role of device geometry and charge trapping
    Canato, E.
    Meneghini, M.
    Nardo, A.
    Masin, F.
    Barbato, A.
    Barbato, M.
    Stockman, A.
    Banerjee, A.
    Moens, P.
    Zanoni, E.
    Meneghesso, G.
    [J]. MICROELECTRONICS RELIABILITY, 2019, 100
  • [2] Degradation Behavior and Mechanisms of E-Mode GaN HEMTs With p-GaN Gate Under Reverse Electrostatic Discharge Stress
    Chen, Y. Q.
    Feng, J. T.
    Wang, J. L.
    Xu, X. B.
    He, Z. Y.
    Li, G. Y.
    Lei, D. Y.
    Chen, Y.
    Huang, Y.
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2020, 67 (02) : 566 - 570
  • [3] A Review of GaN HEMT Dynamic ON-Resistance and Dynamic Stress Effects on Field Distribution
    Gill, Lee
    DasGupta, Sandeepan
    Neely, Jason C.
    Kaplar, Robert J.
    Michaels, Alan J.
    [J]. IEEE TRANSACTIONS ON POWER ELECTRONICS, 2024, 39 (01) : 517 - 537
  • [4] Threshold voltage instability by charge trapping effects in the gate region of p-GaN HEMTs
    Greco, Giuseppe
    Fiorenza, Patrick
    Giannazzo, Filippo
    Bongiorno, Corrado
    Moschetti, Maurizio
    Bottari, Cettina
    Alessandrino, Mario Santi
    Iucolano, Ferdinando
    Roccaforte, Fabrizio
    [J]. APPLIED PHYSICS LETTERS, 2022, 121 (23)
  • [5] Extraction of Dynamic Threshold Voltage in Resistive Load Hard Switching Operation of Schottky-Type p-GaN Gate HEMT
    Hwang, Injun
    Oh, Jaejoon
    Hwang, Sun-Kyu
    Kim, Boram
    Park, Jun Hyuk
    Kim, Joonyong
    Kim, Jongseob
    [J]. IEEE ELECTRON DEVICE LETTERS, 2022, 43 (10) : 1720 - 1723
  • [6] innoscience, Innoscience-Product
  • [7] A Test Circuit for GaN HEMTs Dynamic RON Characterization in Power Electronics Applications
    Javier Martinez, Pedro
    Fernandez Miaja, Pablo
    Maset, Enrique
    Rodriguez, Juan
    [J]. IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2019, 7 (03) : 1456 - 1464
  • [8] Negative Gate Bias Induced Dynamic ON-Resistance Degradation in Schottky-Type p-Gan Gate HEMTs
    Jiang, Zuoheng
    Hua, Mengyuan
    Huang, Xinran
    Li, Lingling
    Wang, Chengcai
    Chen, Junting
    Chen, Kevin J.
    [J]. IEEE TRANSACTIONS ON POWER ELECTRONICS, 2022, 37 (05) : 6018 - 6025
  • [9] Degradation and Recovery of GaN HEMTs in Overvoltage Hard Switching Near Breakdown Voltage
    Kozak, Joseph P.
    Song, Qihao
    Zhang, Ruizhe
    Ma, Yunwei
    Liu, Jingcun
    Li, Qiang
    Saito, Wataru
    Zhang, Yuhao
    [J]. IEEE TRANSACTIONS ON POWER ELECTRONICS, 2023, 38 (01) : 435 - 446
  • [10] True Breakdown Voltage and Overvoltage Margin of GaN Power HEMTs in Hard Switching
    Kozak, Joseph P.
    Zhang, Ruizhe
    Song, Qihao
    Liu, Jingcun
    Saito, Wataru
    Zhang, Yuhao
    [J]. IEEE ELECTRON DEVICE LETTERS, 2021, 42 (04) : 505 - 508