Microchannels-enabled vertical alignment of hexagonal boron nitride in silicone rubber composites to achieve high through-plane thermal conductivity

被引:6
作者
Ji, Yuan [1 ]
Li, Chunhai [1 ]
Wu, Hong [1 ]
Guo, Shaoyun [1 ]
Zhang, Fengshun [2 ]
Qiu, Jianhui [3 ]
机构
[1] Sichuan Univ, State Key Lab Polymer Mat Engn, Sichuan Prov Engn Lab Plast Rubber Complex Proc Te, Polymer Res Inst, Chengdu 610065, Peoples R China
[2] China Acad Engn Phys, Inst Chem Mat, Mianyang 621900, Peoples R China
[3] Akita Prefectural Univ, Fac Syst Sci & Technol, Dept Mech Engn, Akita 0150055, Japan
基金
中国国家自然科学基金;
关键词
Silicone rubber; Microchannels; Vertical alignment; Thermal conductivity; ORIENTATION;
D O I
10.1016/j.compositesb.2024.111965
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Hexagonal boron nitride (h-BN) with high vertical alignment in polymer composites is necessary to improve through-plane thermal conductivity (TC) for thermal management applications. However, how to achieve simple, efficient and precise control of h-BN vertical alignment in polymer composites remains a challenge. Herein, a novel concept of inducing vertical alignment of h-BN in silicone rubber (SR) composites via controlling flow patterns in specially designed microchannels was proposed. The extremely strong elongational and shear stresses provided by the narrow section of the microchannels induced h-BN to align perpendicular to the flow direction. In the subsequent channel, the weak shear stress manipulated h-BN to form a ladder structure in the SR composites, including the vertical core layer and horizontal skin layer. Such ladder structure not only improved the through-plane TC of SR composite but also prevented overheating in the face of local heat sources. Moreover, the obtained SR composites exhibit a through-plane TC of 5.08 W/mK at 34.3 vol % h-BN loading when the horizontal skin layer was removed, indicating excellent heat transfer efficiency for thermal management application. We believe that this work would strengthen both scientific and technological cognition of the filler alignment during polymer composites processing.
引用
收藏
页数:10
相关论文
共 68 条
[1]   Intrinsic particle-induced lateral transport in microchannels [J].
Amini, Hamed ;
Sollier, Elodie ;
Weaver, Westbrook M. ;
Di Carlo, Dino .
PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA, 2012, 109 (29) :11593-11598
[2]   Interacted boron nitride/Mxene hybrids with vertically aligned networks for improving the thermal conductivity, electromagnetic wave absorption and mechanical properties for the polymer-based thermal interface materials [J].
An, Dong ;
He, Rizheng ;
Chen, Jiaqi ;
Li, Zhiwei ;
Sun, Zhijian ;
Yu, Huitao ;
Liu, Yaqing ;
Zhang, Zhiyi ;
Feng, Wei ;
Wong, Chingping .
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2023, 174
[3]   Designable thermal conductivity and mechanical property of polydimethylsiloxane-based composite prepared by thermoset 3D printing [J].
An, Yi ;
Cheng, Renyi ;
Du, Qingyuan ;
Li, Chenglin ;
Liu, Changhao ;
Xu, Hong ;
Gao, Feng ;
Wu, Daming ;
Sun, Jingyao .
COMPOSITES SCIENCE AND TECHNOLOGY, 2023, 241
[4]   Dual 3D networks of graphene derivatives based polydimethylsiloxane composites for electrical insulating electronic packaging materials with outstanding electromagnetic interference shielding and thermal dissipation performances [J].
Anand, Sebastian ;
Vu, Minh Canh ;
Mani, Dineshkumar ;
Kim, Jun-Beom ;
Jeong, Tae-Hyeong ;
Islam, Md. Akhtarul ;
Kim, Sung-Ryong .
CHEMICAL ENGINEERING JOURNAL, 2023, 462
[5]   Experimental and numerical analysis of natural fillers loaded and E-glass reinforced epoxy sandwich composites [J].
Ayyanar, C. Balaji ;
Kumar, Renugadevi ;
Helaili, Sofiene ;
Gayathri, B. ;
Rinusuba, V. ;
Nalini, H. Esther ;
Bal, Trishna ;
Gapsari, Femiana ;
Anam, Khairul ;
Rangappa, Sanjay Mavinkere ;
Siengchin, Suchart .
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2024, 32 :1235-1244
[6]   Thermal conductivity of polymer-based composites: Fundamentals and applications [J].
Chen, Hongyu ;
Ginzburg, Valeriy V. ;
Yang, Jian ;
Yang, Yunfeng ;
Liu, Wei ;
Huang, Yan ;
Du, Libo ;
Chen, Bin .
PROGRESS IN POLYMER SCIENCE, 2016, 59 :41-85
[7]   Vertically Aligned and Interconnected Boron Nitride Nanosheets for Advanced Flexible Nanocomposite Thermal Interface Materials [J].
Chen, Jin ;
Huang, Xingyi ;
Sun, Bin ;
Wang, Yuxin ;
Zhu, Yingke ;
Jiang, Pingkai .
ACS APPLIED MATERIALS & INTERFACES, 2017, 9 (36) :30909-30917
[8]   Sequential Dual Alignments Introduce Synergistic Effect on Hexagonal Boron Nitride Platelets for Superior Thermal Performance [J].
Chen, Yunxia ;
Gao, Zhiming ;
Hoo, Simon A. ;
Tipnis, Varun ;
Wang, Renjing ;
Mitevski, Ivan ;
Hitchcock, Dale ;
Simmons, Kevin L. ;
Sun, Ya-Ping ;
Sarntinoranont, Malisa ;
Huang, Yong .
ADVANCED MATERIALS, 2024, 36 (25)
[9]   Insulating polymer nanocomposites with high-thermal-conduction routes via linear densely packed boron nitride nanosheets [J].
Cho, Hong-Baek ;
Nakayama, Tadachika ;
Suematsu, Hisayuki ;
Suzuki, Tsuneo ;
Jiang, Weihua ;
Niihara, Koichi ;
Song, Eunpil ;
Eom, Nu Si A. ;
Kim, Seil ;
Choa, Yong-Ho .
COMPOSITES SCIENCE AND TECHNOLOGY, 2016, 129 :205-213
[10]   Performance of Thermal Interface Materials [J].
Chung, D. D. L. .
SMALL, 2022, 18 (16)