Polymeric wafer contact surface integrity and uniformity of electrostatic chuck: Characterization and potential impact on ion implant process

Our research aims to use advanced inspection methodology to scan Wafer Contact Surface (WCS) of Electrostatic Chuck (E-chuck) and study how the topographic structure of WCS affects field application. Polymeric WCS in this study was applied using vacuum lamination process and patterned by lithography to 5 um +/- 1 um height. The WCS dimensions were determined by contact profilometry system, while integrity was evaluated by Bruker Contour GTX non-contact optical profilometer. E-chucks are widely used for all major steps of semiconductor process, such as dry etch, ion implantation and PVD, having costly impact on pass/fail rate within over 100 k cycles of their lifetime, thus attracting attention to their material development and enhancement of wafer-supporting structure. However, there are fewer studies available about E-chucks WCS and its macro- or micro-structure. Our research will illustrate a library of defects in WCS and discuss the potential effects in OEM (Original Equipment Manufacturer) applications.