Pico-second laser cutting process for the low damage surface of polycrystal Y2O3 transparent ceramics

被引:0
|
作者
Choi, Kyeonggon [1 ,3 ]
Park, Cheol-woo [3 ]
Kim, Sung-il [3 ]
Kim, Seung-Wook [1 ,2 ]
Lee, Jae-Hyoung [4 ]
Chu, Baojin [5 ]
Jeong, Dae-Yong [1 ,2 ]
机构
[1] Inha Univ, Dept Mat Sci & Engn, Incheon 22212, South Korea
[2] Inha Univ, Program Semicond Convergence, Incheon 22212, South Korea
[3] Corning Technol Ctr Korea, Corning Precis Mat, Asan 31454, South Korea
[4] Cessmat Co Ltd, Ind Acad Cooperat Ctr, Suwon 16419, South Korea
[5] Univ Sci & Technol China, Dept Mat Sci & Engn, Hefei 230026, Peoples R China
关键词
Y2O3; Transparent ceramic; Ultra-fast laser; Cutting process;
D O I
10.1007/s43207-024-00471-0
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Y2O3 transparent ceramics were used to demonstrate the effects of a high-precision ultra-fast laser singulation process. The ultra-fast laser singulation process achieved highly precise cutting, producing a uniform fracture surface without significant damaged areas. Even with an increased number of laser ablations from 10 to 600 times, the width of the damaged regions remained nearly constant, averaging about 48.9 mu m, demonstrating the consistency and advantage of this cutting method for Y2O3 transparent ceramic materials. The ultra-fast laser offers numerous benefits, including precise cutting, minimal thermal impact zones, reduced contamination or material damage, and most importantly, cost efficiency. The measured roughness was only 0.4 mu m compared to 0.9 mu m roughness of mechanically broken areas. These findings can be an essential indicator of the ultra-fast laser's singulation process to accurately cut high-density ceramics while also being economically prudent.
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页码:378 / 386
页数:9
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