Prediction of photopolymerization deformation for additive manufacturing based on thermal simulation approximation

In order to improve the accuracy of ceramic additive manufacturing (AM), predicting the deformation of green parts is very important. In order to simplify the complexity of the microscopic chemical reaction kinetics model and simulate stress and strain with high fidelity, a thermal simulation approximate prediction (TSAP) model for ceramic vat photopolymerization is established. The model uses the thermal–mechanical coupling analysis method to approximate the deformation and internal stress of parts during layer-by-layer printing. By mathematical modeling, the microscopic reaction shrinkage of exposure is theoretically corresponding to the macroscopic cold shrinkage. The input parameters and their changing trends are derived from the fitting of material experimental tests. The practicality of the TSAP model is verified through experiments on different models, providing good guidance for shrinkage compensation in the future.