Thermal interface polymer-based composites materials: a critical review

Effective thermal management is essential for optimizing the performance and ensuring the dependability of electrical devices. The downsizing of electronics and the emergence of new applications such as light emitting diodes lead to a problem in terms of thermal dissipation. This report examines the design concepts of composites with high thermal conductivity, with a specific focus on the elements that affect the conductivity of polymers. The study also examines the characteristics of thermally conductive fillers, their reliance on the amount of filler used, the shape of the aggregate, and the overall structure of the composite. Novel techniques have been developed to manipulate the microstructure of polymer composites to enhance their heat conductivity. These techniques involve managing the alignment of fillers, designing filler clusters in a specific manner, and utilizing self-assembly methods. The review also emphasizes the developing uses of thermally conductive polymer composites.